-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Matrix Offering a Lamination Assist System for Flexible Circuit Lamination
July 17, 2020 | Matrix ElectronicsEstimated reading time: 1 minute
Matrix Electronics is promoting EuroPads® Press Pads and EuroForm® Conformal Release film as a system package for lamination of Flexible Printed Circuit Boards. Designed and offered as part of the new EuroAssist Product Line, EuroPads® and EuroForm® are exceptional alternatives to the many confusing and expensive competitive options currently available. When used together they maximize production yields, quality, and cost savings.
- EUROPADS® are Printed Circuit Board Lamination Press Pads, manufactured to offer pressure equalization and heat lagging benefits. EuroPads® proprietary composition offers consistent performance for PCB Lamination optimization. They possess excellent large-scale uniform pressure equalization, that compensates the inefficiencies created by contact between Press Platens and Tooling Plates.
- EUROFORM® conformal release film, when included as the second part of the system, provides a hydraulic seal around the flexible circuit, creating discreet contact of the film to the circuit board. This enhances the process of resin flow and fill characteristics. When used with EuroPads® in the Flex PCB manufacturing process, EuroForm® balances height differences during the lamination process while providing consistent pressure distribution across the surface of the circuit topography. Examples of applications are:
-
- Laminating Cover-Layers to control-adhesive squeeze out
- Manufacturing Multi-Layer Flexible Circuits with varying bond plies
- Manufacturing Rigid-Flex PCB’s with low-flow prepreg, to prevent air entrapment and minimize voids.
“It’s exciting to have these two flagship components in our Lamination Assist family of products. To date, positive customer trials and market acceptance through qualification confirms the positive benefits of EuroPads® and EuroForm®. Our system brings tangible results,” states Peter Decaneas, Product Manager for Lamination Assist Products at Matrix. “I enjoy working directly with customers sharing the many experiences I am privileged to have seen in my 35 years of direct involvement with Lamination Assist in both Flexible and Rigid Multilayer Laminations worldwide by offering these two new products,” adds Mr. Decaneas.
Suggested Items
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
Lockheed Martin Successfully Transitions Long Range Discrimination Radar To The Missile Defense Agency
04/23/2024 | Lockheed MartinThe Long Range Discrimination Radar (LRDR) at Clear Space Force Station in Clear, Alaska, completed DD250 final acceptance and was officially handed over to the Missile Defense Agency in preparation for an Operational Capability Baseline (OCB) decision and final transition to the Warfighter. In addition, prior to this transition, the system has started Space Domain Awareness data collects for the United States Space Force.