Flex Expert Joe Fjelstad Releases Nine-Part Flexible Circuit Technology Workshop Series

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I-Connect007 is proud to announce the release of a new video workshop series presented by subject-matter expert Joe Fjelstad. Divided into nine sessions, this series provides a comprehensive view of the structures, applications, materials, and manufacturing processes of flexible circuits.

If you’re engaged in designing or using electronic interconnections, flex is arguably one of the most versatile interconnection technologies available.  

Joe said, “There are many reasons to use flex circuits, and it isn’t just because they’re flexible; they’re also thin, lightweight, and high-performance. They allow you to do very fine-line features, which are becoming increasingly important. Flex circuits have a lot of attributes that make them very attractive.”

This is a must-watch series for those who are new to the industry, as well as experienced engineers who want to learn more about the benefits of flex circuits and how to better incorporate them into their products.

Each of the nine workshops can be viewed in about 20 minutes and covers a specific aspect of flex technology. You can get full access to the entire series now by registering here.

We hope you enjoy Joe Fjelstad’s flexible circuit technology workshop series, sponsored by American Standard Circuits, a proud supporter of online education.

About Joe Fjelstad

Joe has been an innovator in flex and rigid-flex technology for four decades. Founder and CEO of Verdant Electronics, he is an international authority and innovator in the field of electronic interconnection and packaging technologies with more than 185 patents issued or pending. Joe has written, co-written, or edited several other books and numerous technical papers and articles. He is also an I-Connect007 columnist and frequently presents seminars on PCBs, flex circuits, and chip-scale packaging technologies at industry conferences.

Related Links

• Joe Fjelstad, Flexible Circuit Technology: 4^th Edition, I-Connect007, November 2011.
• Barry Matties, “Joe Fjelstad Updates His Online Flex Workshop,” Design007 Magazine, July 2020.
• Joe Fjelstad, “Flexible Thinking” columns, I-Connect007.
• Register to download and read Design007 Magazine, including the Flex007 section.
• Anaya Vardya and Dave Lackey, The Printed Circuit Designer’s Guide to Flex and Rigid-Flex Fundamentals, March 2017.
• Find more flex-related news, columns, articles, and interviews at flex.iconnect007.com.

05/18/2023 | Mark Gallant, DownStream Technologies

Everyday rigid FR-4 PCBs have a well-known layer stackup recipe: dielectrics, PCB conductor layers, plane layers, mask, and silkscreen (nomenclature or legend). More advanced layer types may include embedded or screened components or cavities with bonded bare die. Flex and rigid-flex stackups include those similar to rigid PCBs, such as dielectrics, conductor, mask, and silkscreen layers, but that is where the similarity ends. There are many additional layer types present for this genre of PCB. They include types like coverlay, adhesive, conductive film, conductive foil, conductive adhesive, bondply, and stiffener.

04/17/2023 | Mark Gallant, DownStream Technologies

Flex and rigid-flex PCB constructions are not new concepts. It has become commonplace as engineers look for alternative circuit packaging for ever-shrinking electronic products. A flat, one-sheet schematic for a straight ribbon cable is analogous to its physical flat substrate. A flat, multi-sheet schematic that details circuitry for a rigid-flex design bears little visual resemblance to its three-dimensional, variable material rigid-flex assembly. However, in both schematic examples, schematic-based analysis tools are applied equally. This same truth also applies to common FR-4-based two-layer or multilayer PCBs.

08/11/2022 | Andy Shaughnessy, Design007 Magazine

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