-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
Economic Headwinds
In this issue, the biggest names in PCB manufacturing share their economic outlook for the upcoming year and beyond. As you will see, they were all bullish on our industry, but there was some apprehension as well. No one wants to get burned by another the supply chain disruption.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Introducing SMTA’s 2020 Additive Electronics TechXchange, Part 2
September 14, 2020 | Nolan Johnson, I-Connect007Estimated reading time: 3 minutes
The 2020 Additive Conference, hosted by SMTA as an on-site event, will be held this year as a virtual event on October 15, 2020. Concurrent with the change in format, this year’s event has been renamed the Additive Electronics TechXchange.
I-Connect007’s Nolan Johnson spoke with Tech Exchange organizers, Tara Dunn, President of OmniPCB, and Lenora Clark, Director of Autonomous Driving and Safety at ESI Automotive, about this year’s version of the event.
In this second installment, Dunn and Clark discuss the target audience for the Additive TechXchange: What sort of businesses and roles should be in attendance and why?
I-Connect007 continues to deliver original reporting and coverage of the electronics design, electronics manufacturing, and contract manufacturing industries, including up-to-date information from the companies, associations, and supply chains globally. Find the latest news and information at I-Connect007.com.
Related Content:
- To download this audio (mp3) file, click here.
Audio Transcript:
Nolan Johnson: Hi, Nolan Johnson, here for I-Connect007. I’m back with Tara Dunn and Lenora Clark. Tara is the President for Omni PCB, and Lenora is the Director of Autonomous Driving and Safety at ESI Automotive. And we’re talking about the Additive Electronics TechXchange—not the Additive Conference, but the Additive Electronics TechXchange. We established that in our last conversation. Welcome.
Tara Dunn: Thanks, Nolan, for having us.
Johnson: This conversation topic is your target audience for the Additive Electronics TechXchange. Who should be there?
Dunn: All aspects of the electronic supply chain should be there. That would be my hope. Our presenters this year are going to be focused as end-users. They’re going to be presenting on what their needs are for electronics in this space or this sub-3-mil line in space, as well as what their hurdles are in finding this technology throughout the industry. Anybody who has a need for sub-3-mil line in space thinks they may have a need for it in the future, or who’s just simply curious about what the benefits may be if you’re moving into that segment of the market would all learn a lot from these presentations.
Others that should attend should be PCB fabricators that may be supplying this technology. There are ramifications for materials and chemistry, and EMS companies are going to need to assemble designs that are down in this new area. Nearly anybody from the supply chain could benefit from the conference.
Lenora Clark: I agree. And as Tara said, we’ve set this up so that the end-users are the presenters. We specifically did that this year to get their perspective on, as she said, needs and challenges. But at the end of the conference, we’ve set up a session that we call “Your Voice Will Be Heard.” And this is an opportunity for those within the supply chain to say, “We have a material that might be successful or people might be interested in it because it does this, this, and this.” But it’s also an opportunity to ask more detailed questions. It will be open to the entire audience, both speakers and listeners, to vet out not only the promise but the shortcomings and to get a better understanding.
And we all know that when the details are out on the table, development is so much easier. When you have a clear understanding of performance requirements, but also current set challenges associated to it, it’s just so much more valuable for development. And if we can create this collaborative environment, which is what Tara and I expect to do, we anticipate that it will shorten the development process by getting people to work together.
Johnson: Your speakers list would be a great place to get some market data.
Clark: This year, we have a nice cross-section of consumer, Department of Defense, and telecommunications perspectives in there. It should be a good cross-section. Our keynote speaker is from Prismark, and he will hopefully give us a nice understanding of where this technology stands today.
Dunn: I agree completely with Lenora. With the lineup that we have, we’re going to see a great cross-section of user needs across all different markets.
Johnson: We have other conversations to have with you over the next few days, including a deeper dive into the speakers list and who will be there. Thanks for the teaser there on Prismark. With that, I just want to thank you for talking with us here today.
Clark: Thanks again.
Dunn: Thanks, Nolan.
Johnson: For I-Connect007, I’m Nolan Johnson and thanks for listening.
Suggested Items
Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC
03/18/2024 | IPCDevan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly created role, Dr. Iyer leads IPC's work with leading electronics companies and governments to identify and deliver news solutions to IPC members and the industry.
IEC Congratulates Bruno Ferri for 25 Years of Service
03/19/2024 | IECPlease join IEC (International Electronic Components) in congratulating Bruno Ferri for 25 years of service and camaraderie. Bruno is an integral part of our team and has significantly contributed to our success.
ROCKA Solutions Expands into Brazil
03/15/2024 | ROCKA SolutionsROCKA Solutions is thrilled to announce its expansion into Brazil. With a commitment to serving the growing needs of the Brazilian electronics manufacturing market, ROCKA has established new distribution and manufacturing services in the region.
Altium to Exhibit Latest Innovations at Embedded World 2024
03/15/2024 | AltiumAltium (ASX: ALU), a global leader in electronics design systems, will be at Embedded World 2024 to reveal its latest innovations across its ecosystem, spanning Altium Designer,
Northrop Grumman Honors Suppliers for Excellence
03/14/2024 | Northrop GrummanNorthrop Grumman Corporation honored more than 70 suppliers for their outstanding contributions in 2023. In an annual recognition event, the companies included women-, minority- and veteran-owned small businesses as well as those operating in underdeveloped areas.