EIPC Presents Technical Snapshot Webinars

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During the Autumn of this year, EIPC will be organising three webinars which will be of particular interest to those involved with automotive, telecom and high-speed technology. We will have three well-known PCB industry speakers, each of whom has their own view on the technology challenges facing this industry.

This first session will focus on automotive technology and some of the key factors driving the global Automotive Printed Circuit Board industry. They will look at how the whole supply chain of PCB manufacturing can be ready for that change which will need input on materials, processes, measurement systems, reliability, and environmental impact and are there some new technologies for PCB manufacturing which will support these new demands.

The webinar on 14th of October will start at 15.00 hrs CEST.

The presenters this day will be:

Lenora Clark from ESI Automotive

Her presentation topic: An exploration of advanced semiconductor packaging’s effect on automotive electronic hardware design and assembly

  • In the presentation there will be discussion and review on all aspects of the electronic build, starting with how increased performance influences the semiconductor packages, how that then affects design for PCB fabrication, and finally it considers the influence on materials for perfect assembly.

Alun Morgan from Ventec

His presentation topic: "Reliability needs to be designed-in from the lowest level"

  • In the presentation you will hear about cutting-edge technology demands more care to ensure reliability and resilience.

Paul Waldner from Multiline

His presentation topic: "Multilayer Printed Circuit Requirements for the Automobile Industry in the Age of High Speed”

  • The PCB industry is facing the challenge of automotive and 5G product requirements based on the demand for higher speed. The material offering is wide and requires well-controlled technology for PCB manufacturing. One of the critical processes is multilayer pressing and registration which are also key challenges for high-speed products.
  • We would like to present a new technology to laminate multilayers at very high temperatures with a control of temperature per panel previously thought to be impossible. Conventional Multilayer presses require huge amounts of energy pushed into a relatively high stack of to-be-laminated panels from a huge mass of metal that had to be heated up even before the panels could begin to be heated up. This meant that the temperature gradient of a stack of laminates could be as high as 40 degrees C from the outside-panels in the stack to the inside-panel. Indubond’s press technology can heat every panel in a stack to exactly the same temperature at exactly the same time.
  • The presentation will also introduce the technology of registering those panels is old, but still necessary to insure the best registration of multilayers composed of differing materials no matter how hot the press. Pin-lam combined with data collection of inner-layer movements at every point in the fabrication process is worth discussing again.
  • The signal integrity of high speed circuits is also helped by as near-to-perfect rectangular cross-sections of the tracks that comprise the way from sensors to processors to output devices. Multiline would like to introduce to Europe a new semi-additive process which is designed to improve signal integrity while making it easier to improve resolutions of tracks and gaps.

Registeration is free of charge to EIPC Members. The Non Member fee is € 50.- Visit eipc.org.



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