Nolan Johnson speaks with Audrey Sim, executive director and vice president of operations for the Hong Kong Printed Circuit Association, about the upcoming Electronic Circuits World Convention, to be held November 30 through December 2, 2020. Ms. Sim gives Nolan an overview of the convention’s history, its scope as a printed circuit industry convention, and its shift to a hybrid virtual/physical format for 2020.
06/24/2022 |
I-Connect007
I-Connect007 is excited to announce the release of the second title in Ventec’s series on thermal management, "The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates, Volume 2." This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples, and focusing on specific solutions and enhanced properties of IMS.
04/08/2022 |
Nolan Johnson, I-Connect007
Nolan Johnson speaks with Will Marsh, vice president of TTM Technologies and president of the Printed Circuit Board Association of America, about the work the PCBAA has been doing in Washington, D.C., to get the industry better recognized by the country’s decision-makers. Marsh is optimistic, not only about the companies and individuals joining the effort, but in the recognition by Capitol Hill to secure the nation’s defense systems.
03/31/2022 |
Jeff Brandman, Aismalibar North America
Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes were first used to receive and transmit data bits. The transistor and integrated circuit effectively solved that basic problem, but increases in integration resulted in increased concentration of heat, exacerbated by relentless increases in operating frequency. While improvements in electronics technology have been able to mitigate many thermal issues at chip level thanks to improved semiconductor designs devised to operate at lower voltages (thus requiring less energy) the thermal management challenge continues to vex electronic product developers.