IPC APEX EXPO 2021 Goes Virtual


Reading time ( words)

IPC APEX EXPO 2021 will be offered virtually, March 8-12, 2021.

“Given ongoing COVID-19 health and safety concerns and continued restrictions for large gatherings and events in California, it was not feasible to safely convene the nearly 9,000 expected participants at IPC APEX EXPO 2021,” said IPC President and CEO John Mitchell. “The event will now take place in a safe, all-virtual format.”

While the event is going virtual, IPC APEX EXPO will still be the place to connect, collaborate and learn as the event’s virtual platform will allow attendees, exhibitors and speakers to easily navigate more than 100 technical conference sessions and professional development courses as well as product demonstrations, and schedule one-on-one meetings with exhibitors. As an added bonus, technical conference sessions will be available to registered attendees for replay, providing a unique opportunity to take advantage of education for 90 days after the event.

And rounding out the immersive experience, attendees can attend multiple keynotes, a “meet and greet” with IPC Hall of Famers and Emerging Engineers, participate in a virtual trivia event, and learn about cutting edge products and technologies during daily exhibitor new product introductions.

Mitchell added, “Be it in person or via an online platform, it is IPC’s goal to maintain IPC APEX EXPO’s position as the premier event for the electronics manufacturing industry, providing practical applications for learning – knowledge that attendees can immediately apply to their work and as well as far-reaching insights that can be applied toward implementing future technologies. Wherever in the world you may be located, IPC APEX EXPO 2021 is the place to be.”

Registration for IPC APEX EXPO 2021 is expected to open December 17. To view schedule at a glance and exhibitor list, visit www.ipcapexexpo.org. IPC APEX EXPO will return to an in-person format in 2022 and will take place January 25–27, 2022 at the San Diego Convention Center.

Share

Print


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

04/09/2021 | Andy Shaughnessy, I-Connect007
In this week’s roundup, we have news about a new DFM environment from Siemens EDA, a 2D field solver from Avishtech, and a milestone for the IPC-CFX-2591 QPL. We also have a great article by Calumet’s Audra Thurston, who points out the many advantages of a virtual trade show. And in his latest column, Denny Fritz explains why the DoD is now thinking like many U.S. OEMs—worrying about single-source components, for instance—but the stakes are much higher.

Technical Conference—Balancing Conventional and Disruptive Technologies

04/08/2021 | Matt Kelly, IPC
I thought the three keynotes given by IPC President and CEO John Mitchell, Industry Week Editor-in-Chief Travis Hessman, and IPC Chief Economist Shawn DuBravac, were spot on. They all spoke to the fact that the way products are conceived, designed, manufactured, and used is changing rapidly. While the keynotes had different focus areas, I noted an important similarity—they all underscored the need for increased industry collaboration to help bring the factory and supply chain of the future to life.

Emerging Engineers: Audra Thurston

04/02/2021 | Audra Thurston, Calumet
To be honest: I was skeptical when I first heard IPC APEX EXPO 2021 was going to be virtual. We have all attended too many Zoom meetings that are not engaging, and it is easy for virtual events to fall into this stereotype. However, after attending this one I am a full supporter of the virtual format and hope the IPC considers a hybrid format for future conferences!



Copyright © 2021 I-Connect007. All rights reserved.