During a recent conversation on industry topics, Nolan Johnson asked Dan Feinberg, PCB fabrication pioneer, businessman and IPC Hall of Fame inductee, about his favorite career moments. In this clip, we proudly share with you two of Dan’s highlights. Both of these memories speak to Dan’s role as a trailblazer in electronics manufacturing—first in the U.S, then across the globe.
To download this audio (mp3) file, click here.
John Strubbe, Taiwan Union Technology Corporation
Taiwan Union Technology Corporation (TUC) provides copper-clad laminates and dielectric resin composites used to manufacture printed circuit boards. The enthalpy of these resin composites meets and exceeds customers’ objectives and shows the deterioration of the resin’s physical properties as a result of multiple lamination cycles (up to 10X). This article describes how TUC evaluates the possible change in resin structure due to multi-thermal laminations.
I-Connect007 Editorial Team
Calumet Electronics has been a domestic pioneer with additive and semi-additive electronics manufacturing processes. We recently asked Calumet’s Todd Brassard and Meredith LaBeau to discuss the state of this technology, which traditional processes that they might replace, and some of the challenges facing OEMs or PCB shops that are considering these options.
Happy Holden, I-Connect007
For North America, there is a growing need for more ultra-high density HDI capability. Some of the reasons for the slower adoption of SAP/HDI fabrication may rest with two obstacles: Subtractive processes have difficulty as they approach 50-micron traces and spaces (0.002”), and it is not clear what the total system acquisition costs will be for ultra-HDI.