I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Reading time ( words)

Top5_reads_303.jpgA perennial and yet irregular category on the popular game show Jeopardy is “potpourri.” My dad, as I was growing up, pronounced the word as “pot-poury.” It wasn’t until I was a sophomore in college that my girlfriend’s mom—who had a penchant for a soupcon of French euphemism in her tête-à-têtes—pronounced the word properly: “po-pu-ree.” Such are the risks of growing up just a bit rural.

On Jeopardy, the category is defined as “a mixing of unrelated, leftover questions from previous shows, so we’re lumping them under ‘Potpourri.’”

Now far be it for me to characterize this week’s top five as unrelated or leftover. Nor are they recycled from earlier weeks. This week’s topics are, however, heavier on mixture: a little bit from all over. There’s an industry sales report, Pete Starkey conference report, a look both backward and forward with Taiyo’s John Fix, an Altium/Amazon AWS working relationship in the news, and a brand-new I-007ebook on SMT Inspection from Koh Young’s Brent Fischthal.

Yep. A healthy mix of variety this week, doing “Potpourri” proud.

North American PCB Industry Sales Begin 2021 Up 4% 
Published February 26

The IPC book-to-bill ratio weighs in at 1.14 for January, up 17.6% over January 2020. Hold this news up to the European Semiconductor Industry Association report that global semiconductor sales in 2020 logged a 6.5% increase from 2019, and it looks like the wave of increased demand is moving down the pipeline toward the assembly facilities.

2020: A Year of Learning, Innovation for Taiyo America 
Published March 1

Pete Starkey has a virtual visit with John Fix, director of Sales and Marketing at Taiyo America, where they discuss the changes taking place because of COVID-19 restrictions, and some new products—including a new dry film solder mask for flexible circuits. Starkey and Fix’s discussion of how this new product works makes for interesting reading.

EIPC Technical Snapshot: Cleanliness 
Published March 1

Cleanliness was the focus of this informative and enlightening event on Feb. 17, 2021, introduced by EIPC technical director Tarja Rapala-Virtanen and moderated by EIPC board member Christian Behrendt, CEO of German PCB fabricator ILFA. Pete Starkey brings his trademark summary of proceedings, including presentations from Freddy Gilbert, Professor Rajan Ambat, Emma Hudson, and Christian Behrendt.

Altium, AWS Collaborate to Advance Electronic Design 
Published February 26

Cloud-based data sharing continues to move to the mainstream in all areas of modern life, and the engineering disciplines are no exception. For example, the Altium 365 cloud-based platform and Altium Designer is working to create “the most connected design experience” in the industry, streamlining the product development process through thoughtful sharing of centrally-stored design data. To achieve this goal, Altium selected Amazon Web Services (AWS) to host Altium 365, the cloud platform for collaborative PCB design and realization.

New I-007eBook Highlights SMT Inspection: Today, Tomorrow, and Beyond 
Published March 3

If you have an interest (and who doesn’t?) in PCB board inspection, you know that even engineers and layout specialists are involved in making inspection succeed by the decisions made during the design phase). This new I-0007eBook from Koh Young is a must read. In The Printed Circuit Assembler’s Guide to SMT Inspection: Today, Tomorrow, and Beyond, author Brent Fischthal takes readers through a brief history of SMT inspection before discussing the benefits of data-driven analytics and how intelligent software solutions can help companies analyze and optimize the production process.



Suggested Items

Real Time with... IPC APEX EXPO: Taiyo Focuses on Collaboration

01/12/2022 | Pete Starkey, I-Connect007
Don Monn, Midwest regional sales director at Taiyo America, reviews the progressive adoption of inkjet solder mask technology while acknowledging that liquid photoimageable mask continues as the mainstream process, with new developments in double-sided coating and vertical drying equipment. He comments on how Taiyo’s collaborative relationships with suppliers and customers have enabled logistics to be successfully managed through difficult times.

Real Time with... IPC APEX EXPO: Burkle Has a Sharper Image

01/11/2022 | Nolan Johnson, I-Connect007
Kurt Palmer, president of Burkle North America, speaks with Editor Nolan Johnson about the latest advancements in imaging and the equipment that Burkle will be demonstrating at IPC APEX EXPO in San Diego. If you can’t make it to IPC APEX EXPO, don’t worry. We’ll be bringing you interviews with the engineers, managers and technologists who are making a difference in our industry.

Agfa Taking Leap to Digital Platform

12/13/2021 | Pete Starkey, I-Connect007
I-Connect007 Technical Editor Pete Starkey spoke with Agfa Business Unit Manager Frank Louwet ahead of last month’s productronica show in Europe. They discuss the company’s desire to reduce its carbon footprint and the benefits of this change, particularly with a move to digital inkjet printing, and describes some of the company’s newest products. As Louwet explains, "Our claim is 'Grow your business, not your footprint.' By going digital you can grow your business without having to increase your waste materials, your processing chemicals, your water, and even your floor space."

Copyright © 2022 I-Connect007. All rights reserved.