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Atotech, a global supplier of specialty chemicals, equipment, software, and services will take part and present at this year’s 71st Electronics Components and Technology Conference ECTC, which will be held as a virtual conference from June 1 through July 4.
Our topics this year include:
- Cu Recrystallization and the Formation of Epitaxial and Non-Epitaxial Cu/Cu/Cu Interfaces in Stacked Blind Micro Via Structures” by Tobias Bernhard, R&D Scientist at Atotech; session 40: Materials and Techniques in High-Speed Interconnect #5
- Towards Cu-Cu Direct Bonding: Controlled Crystal Growth of Copper Deposits for Minimization of Interface Formation During Bonding” by Ralf Schmidt, R&D Manager at Atotech; session 40: Materials and Techniques in High-Speed Interconnect #9.
Both sessions will be available on demand. We look forward to welcoming you at ECTC 2021.
Atotech is a leading specialty chemicals technology company and a market leader in advanced electroplating solutions. Atotech delivers chemistry, equipment, software, and services for innovative technology applications through an integrated systems-and-solutions approach. Atotech solutions are used in a wide variety of end-markets, including smartphones and other consumer electronics, communications infrastructure, and computing, as well as in numerous industrial and consumer applications such as automotive, heavy machinery, and household appliances.
Atotech, headquartered in Berlin, Germany, is a team of 4,000 experts in over 40 countries generating annual revenues of $1.2 billion (2020). Atotech has manufacturing operations across Europe, the Americas, and Asia. With its well-established innovative strength and industry-leading global TechCenter network, Atotech delivers pioneering solutions combined with unparalleled on-site support for over 9,000 customers worldwide.