NPL Webinar to Highlight New Research Project Portfolios

Reading time ( words)

The use of electronic devices in sectors such as automotive, aerospace, defence, energy, and renewables is widespread, and the expectation for them to operate effectively and over the long-term in harsh environments intensifies.

The National Physical Laboratory (NPL) continues to pioneer new test methods that help manufacturers and designers understand performance and, therefore, help mitigate costly and reputational damages.

In line with this, NPL’s Electronic Materials Group is determining its research programme for the next three years and is inviting the industry to join the discussion to influence research priorities and project parameters to best fit the industry’s requirements.

Presented by Senior Research Scientist Martin Wickham, the webinar will share the Electronic Materials Group’s vision with details of its proposed new project portfolio and capabilities.

The webinar will be held on 22 June 2021 at 14:30 BST.



Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/26/2021 | Andy Shaughnessy, Design007 Magazine
This week, we have a round-up of stories from around the industry, including a Real Time with… IPC APEX EXPO interview with Ventec, an article by Tamara Jovanovic about eliminating “garbage in, garbage out,” a review of an EIPC webinar by Pete Starkey, and news about another trade show going virtual this summer. And last but certainly not least, we bring you our one-minute video salute to all the fantastic people in this industry who we’ve worked with for decades. Enjoy!

Bonding Hybrid Multilayer Constructions at Rogers Corporation

03/10/2021 | Real Time with...IPC
John Ekis, Rogers Corporation's market segment director for aerospace and defense, discusses the SpeedWave family of low-dielectric constant, ultra-low-loss prepreg materials with excellent filling and bonding characteristics for hybrid multilayer constructions. SpeedWave prepreg is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing. SpeedWave is available in multiple spread and open weave glass style and resin content combinations, and is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.

Focus on Smart Processes, Not Just Smart Factories

03/02/2021 | Nolan Johnson, PCB007
Nolan Johnson talks to Audra Thurston, Todd Brassard, and Meredith LaBeau about how Calumet is focusing on smart processes, and not as much on smart factories. While modern manufacturing equipment and next-gen technologies can be impressive, so much innovation still hinges on human beings. Calumet believes by investing in their workforce and instilling a culture of innovation throughout their company and supply chain, they’ll see faster advancement.

Copyright © 2021 I-Connect007. All rights reserved.