Nordson Electronics Solutions Introduces MARCH MegaVIA Plasma Treatment System

Reading time ( words)

Nordson Electronics Solutions, a division of Nordson Corporation, a global leader in plasma processing technology, introduces the MARCH MegaVIA™ Plasma Treatment System with a 15-cell configuration for panel sizes up to 30 x 52 inches in printed circuit board manufacturing. With overall dimensions of 1652mm W x 1782mm D x 2326mm H, the new MegaVIA™ system offers increased panel loading by more than 54% with only a 2% increase in footprint when compared to a MARCH MaxVIA™-Plus. The new platform delivers high process reproducibility and plasma treatment uniformity for PCB panels.

“Nordson has set the global standard for plasma treatment in the PCB market for more than 35 years with its industry-leading MARCH VIA platform,” explained Al Bousetta, director of marketing, MARCH Products. “The new MegaVIA™ plasma system builds on the success of earlier platforms with increased process capacity for large panels and minimum use of valuable production floor space. As with other VIA series products, the system provides uniform plasma treatment results to meet rigorous PCB manufacturing requirements.”

The MegaVIA™ system provides plasma treatment at 40 kHz and accommodates all common gases -- CF4, oxygen, nitrogen, and argon -- with high process reproducibility and uniformity. An EPC controller with intuitive Windows® 10 PC-based touch screen HMI allows for a wide range of data collection and control capabilities.

Plasma treatment uniformity is critical for a large chamber system. Higher than 80% uniformity for desmear and etch back applications to both sides of the PCB panels is achieved using the MegaVIA™ system’s power-power electrode configuration, balanced vacuum and gas flow, and temperature management technologies.




Suggested Items

A Conversation with Canice Chung, TTM Technologies

12/09/2014 | Barry Matties, I-Connect007
We had the opportunity to sit down with Canice Chung, Executive Vice President of TTM Technologies, Inc. to discuss the current trends and challenges of PCB Manufacturing in China.

A Conversation with Laurent Nicolet, Schmid Group

12/07/2014 | Barry Matties, I-Connect007
During the HKPCA & IPC Show 2014, Laurent Nicolet, VP - PCB Business Unit of Schmid Group took a few minutes to discuss the automation technology that was on display and share the changes he's seen in the China market.

Thin PCBs for Smart Phones: Technology and Reliability Considerations

11/19/2014 |
The next generation of smartphones will demand very thin multilayer boards to reduce product thickness. This paper shows three different manufacturing approaches which can be used for very thin, any-layer build-ups. The technological approaches are compared on reliability level--the any-layer copper filled microvia technology which is to be considered state-of-the-art for high-end phones and the ALIVH-C/G technology well established in Japan.

Copyright © 2021 I-Connect007. All rights reserved.