EIPC to Hold Technical Snapshot Webinar on November 24

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EIPC will be holding a live technical webinar featuring Daniel Schulze of Dyconex, Lars Böttcher of Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM, and Michael Schleicher of Semikron Elektronik GmbH.

To be held on November 24, 2021, the webinar will tackle advanced high-density packaging substrates for RF and miniaturization, high-density substrate technologies for fan-out and panel-level packaging, and disruptive approach in the design and tool chain of additively manufactured circuit boards.

For more information or to register, contact eipc@eipc.org.


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