Reading time ( words)
EIPC will be holding a live technical webinar featuring Daniel Schulze of Dyconex, Lars Böttcher of Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM, and Michael Schleicher of Semikron Elektronik GmbH.
To be held on November 24, 2021, the webinar will tackle advanced high-density packaging substrates for RF and miniaturization, high-density substrate technologies for fan-out and panel-level packaging, and disruptive approach in the design and tool chain of additively manufactured circuit boards.
For more information or to register, contact email@example.com.
Andy Shaughnessy, I-Connect007
In this week’s must-reads, we have coverage of NAMM 2023 and SMTA Atlanta, plus some tips for traditional PCB designers who are entering the RF design space, where designers have to master ideas like antenna tuning. We also have some news about March PCB sales, as well as a great conversation with Ventec’s Frank Lorentz, who explains how to set up an onboarding process that converts new hires into happy, long-term employees.
Nolan Johnson, I-Connect007
I try to not talk about the weather in this space, but this week I feel compelled. I’m based in the Pacific Northwest, and we’re relatively used to it being wet and rainy. But just south of us in California, the state has gone from what I read has been called the driest period in the West in the past 1,200 years to a right proper drenching. This week’s news cycle felt like one of those California-style “atmospheric rivers.” There was so much worthy reporting worthy that I was a bit overwhelmed in making my final selections. Suffice it to say that, this week, there is quite a bit of news that’s worth your time to read.
Julia Gumminger, IPC
The IPC APEX EXPO 2023 Technical Conference at the San Diego Convention Center will feature two hot topics—Advanced Packaging and e-Mobility/EV Automotive—in custom and curated Special Sessions on Thursday, Jan. 26. Please plan your travel accordingly to attend these exciting sessions.