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MacDermid Alpha to Exhibit, Present at TPCA and IMPACT
December 14, 2021 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and will present at the IMPACT Conference, co-located with TPCA at the Nangang Exhibition Center Taipei, Taiwan, December 21-23, 2021.
Maddux Sy, Applications Manager for the Metallization group, will be presenting “ RDL and Pillar Fabrication from a Versatile Copper Plating Process“. The paper discusses the challenges fabricators face not only in meeting the copper plating performance requirements but also in reducing manufacturing process costs.
Interested participants can stop by booth K606 in Hall 1 to talk to our industry experts about the latest offerings from MacDermid Alpha. Featured in the booth will be the MacDermid Enthone brand of product offerings that enable the most complex printed circuit board and IC Substrate designs. Highlighted will be the entire Systek family of high performance build-up processes for IC Substrate RDL that provide multiple process flows for differet materials, Affinity 2.0, the new Affinity Gold 3.0 and the soon to be released Affinity Select, the OSP compatible selective ENIG process. Also featured will be the full portfolio of MacuSpec acid copper products that meet all applications, from ultra-aspect ratio conformal plating down to filling the smallest blind microvias.
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Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
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ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
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Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
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Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?