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MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and will present at the IMPACT Conference, co-located with TPCA at the Nangang Exhibition Center Taipei, Taiwan, December 21-23, 2021.
Maddux Sy, Applications Manager for the Metallization group, will be presenting “ RDL and Pillar Fabrication from a Versatile Copper Plating Process“. The paper discusses the challenges fabricators face not only in meeting the copper plating performance requirements but also in reducing manufacturing process costs.
Interested participants can stop by booth K606 in Hall 1 to talk to our industry experts about the latest offerings from MacDermid Alpha. Featured in the booth will be the MacDermid Enthone brand of product offerings that enable the most complex printed circuit board and IC Substrate designs. Highlighted will be the entire Systek family of high performance build-up processes for IC Substrate RDL that provide multiple process flows for differet materials, Affinity 2.0, the new Affinity Gold 3.0 and the soon to be released Affinity Select, the OSP compatible selective ENIG process. Also featured will be the full portfolio of MacuSpec acid copper products that meet all applications, from ultra-aspect ratio conformal plating down to filling the smallest blind microvias.
Denis Jacques, Technic Inc.
About three decades ago, immersion silver, a nitrate-based process, gained a lot of market share in the world of PCB final finishes. More economical than ENIG, flat, solderable, and conductive, it had everything going for it—everything but corrosion resistance in a harsh environment, that is. Champagne voids were also an issue, along with line reduction. But the worst drawback, the characteristic that made the part short over time, was creep corrosion. A build-up of copper sulfide salt that grows in contact with a sulfur-rich environment, heat, and moisture resulted in failures in the field. This was enough to scar the process for good.
Pete Starkey, I-Connect007
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.
Pete Starkey, I-Connect007
At last, a live EIPC conference and this time in the Swedish city of Örebro, “where history and contemporary culture converge,” a pleasant and convenient location for an event that included a privileged visit to the Ericsson facility in Kumla. Around 100 delegates made the journey and the Örebro Scandic Grand Hotel was an excellent conference venue for the June 14-15 conference.