-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdditive Manufacturing
In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.
The Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Atotech to Participate at IPC APEX EXPO 2022 and Present Four Technical Papers
January 13, 2022 | AtotechEstimated reading time: 1 minute
Atotech, a leading specialty chemicals technology company and a market leader in advanced electroplating solutions will take part at IPC APEX EXPO 2022 and present four technical papers this year, touching on the following hot industry topics “crystal structures in plated microvias”, “electroless palladium plating”, “Pd-free activation for electroless Cu”, and “nano structuring photoresist adhesion promoter”. For Atotech’s work on analyzing and improving the crystal structures in plated microvias, our technical paper has been selected as Honorable Mention for the 2022 IPC APEX EXPO Technical Conference. Both, IPC APEX EXPO and its accompanying Technical Conference will be held at the San Diego Convention Center in San Diego, CA from January 22 to 27. The Atotech global team will be at booth 3317 to discuss this year’s technical paper presentations, show highlights or to exchange ideas on new technology demands.
The Atotech technical papers at IPC APEX EXPO Technical Conference 2022:
Session 06: "Microvia design and test 2"
Tuesday, January 25, 2022
Time: 1:30 p.m. to 3:00 p.m.
Topic: Recrystallization and the resulting crystal structures in plated microvias” by Roger Massey
Session 14: "Surface finishes & coatings"
Wednesday, January 26, 2022
Time: 10:00 a.m. to 12:00 p.m.
Topic: “Electroless palladium plating – Correlating plating solution and deposit properties” by Gustavo Ramos
Session 18: "High-density interconnects / Semi-additive processes 2"
Wednesday, January 26, 2022
Time: 1:30 p.m. to 3:00 p.m.
Topic: “Palladium-free activation process for electroless copper deposition” by Roger Massey
Session 30: "High speed PCBs & signal integrity considerations"
Thursday, January 27, 2022
Time: 10:00 a.m. to 11:30 a.m.
Topic: “Nano structuring photoresist adhesion promoter for improved signal integrity in the modern HDI-PCB fabrication” by Christopher Seidemann
Please note, IPC and the state of California have strict COVID-19 protocols in place to protect show attendees. Please visit https://www.ipcapexexpo.org/ for more information and for the Atotech show featured click here: IPC download area - Atotech.
For more information about Atotech or its product offering, please visit www.atotech.com
Suggested Items
DuPont Showcases AI Innovations Featuring Advanced Interconnects at 2024 International Electronic Circuits Exhibition
05/13/2024 | DuPontDuPont announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai. With a product portfolio that includes fine line, signal integrity, power and thermal management, DuPont will exhibit at Booth #8L06 at the National Exhibition and Convention Center (NECC) from May 13 to 15.
MKS’ Atotech to Participate in ECTC
05/10/2024 | MKS’ AtotechAt this year’s 74th IEEE Electronic Components and Technology Conference (ECTC), MKS’ Atotech will present and demonstrate its latest product and service innovations.
The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.