HDP User Group Announces LiloTree Membership


Reading time ( words)

High Density Packaging (HDP) User Group is pleased to announce that LiloTree has become a member.

“LiloTree is excited to be a member of the HDP User Group. We look forward to engaging and learning from member partners through the collaborating efforts approach fosterd by the HDP team. LiloTree has invented several novel surface finish solutions for optimum performance and better reliability including a technology for high frequency PCBs applications. By contributing our knowledge in surface finishes, we believe that our participation will assist in the projects related to printed circuit boards raw-materials, reliability and signal integrity,” said Dr. Kunal Shah, President at LiloTree.

“I am pleased to welcome LiloTree to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in surface finishes for printed circuit boards will contribute significantly to several of our projects, especially those focused on high-frequency applications”, said Larry Marcanti, Executive Director of HDP User Group.

Share




Suggested Items

EIPC Summer Conference 2022: Day 2 Review

06/29/2022 | Pete Starkey, I-Connect007
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.

EIPC Technical Snapshot: 5G and Loss Minimisation

03/26/2021 | Pete Starkey, I-Connect007
Bringing a specialised technical area into sharp focus, this month’s topic was “5G and the understanding of loss minimisation at the PCB level,” with papers on dielectric material, copper foil, and modelling solutions. The webinar was moderated by EIPC board member Paul Waldner managing director of Multiline International Europa, who admitted that he had managed to get a haircut especially for the occasion!

PCB Surface Preparation Before Solder Mask on Non-copper Finishes

04/08/2020 | Nikolaus Schubkegel
A circuit board is made of copper. Usually, final finishes are applied after the solder mask process. In some cases, for special applications, the final finish may be applied before solder mask. In this case, we have solder mask on ENIG or galvanic nickel-gold. It is also possible to have tin or tin-lead under solder mask; this was an old technology that no longer plays a role today.



Copyright © 2022 I-Connect007. All rights reserved.