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The objective of iNEMI’s Low Temperature Materials for 1st Level Interconnect project is to determine the extent to which the use of lower temperature processes can provide solutions to the challenges of the accelerating trend toward heterogenous integration. Most of the elements of these packages have limits on temperature/time exposure, which makes materials that can effect reliable connections at temperatures lower than those required by conventional materials worth consideration.
A task force has reviewed material and process options currently available or under development on the basis of their compatibility with the interfaces that have to be connected and the operating conditions to which they are likely to be exposed in integrated circuit packages. Join us for this webinar in which the results of our findings about the prospects for the adoption of low temperature materials for 1st level interconnect will be presented and discussed.
Registration
This webinar is open to industry; advance registration is required. Two webinars (with the same content) are scheduled — please join whichever session fits your schedule, please visit iNEMI's website.
Session 1 (APAC)
Tuesday, June 28, 2022
10:00-11:00 a.m. JST (Japan)
9:00-10:00 p.m. EDT (Americas) on Monday, June 27
Session 2 (Americas & EMEA)
Tuesday, June 28, 2022
9:00-10:00 a.m. EDT (Americas)
3:00-4:00 p.m. CEST (Europe)
10:00-11:00 p.m. JST (Japan)
