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Zhen Ding Technology Holding Ltd, a Taiwan-based company primarily engaged in the design, development, and manufacturing of printed circuit board (PCBs) including rigid PCBs, flex PCBs, HDIs, substrate-like PCBs (SLP), and rigid-flex PCBs, has posted sales of NT$12.64 billion ($424.46 million at $1:NT$29.78) for June 2022, up by 22.7% year-on-year (YoY) and by 9.4% from the previous month.
For the first half of the year, the company reached total sales of NT$68.45 billion ($2.3 billion), an increase of 20% compared with the same period last year. For the second quarter, the company posted sales of NT$34.5 billion ($1.16 billion), up by around 2% sequentially and by 16% YoY.
Cody Stetzel, Cadence Design Systems
I have the tendency to try to replicate the delicacies I’ve ordered at restaurants in my own kitchen. One of my latest attempts at creating restaurant-worthy dishes was a Korean pancake that’s crispy on the outside but soft on the inside. With my amateur cooking skills, it proved to be an impossible task—I could either make only a hard pancake or one that was total fluff. While I’m still struggling to figure out the trick to bringing together the different textures of a Korean pancake, I’ve had more success in bringing together the hardboard elements and flexible PCB elements of a rigid-flex PCB. Compared to making Korean pancakes, striking the right balance of flexibility and rigidity on a rigid-flex PCB is easy if you abide by rigid-flex PCB design guidelines.
Nolan Johnson, I-Connect007
Key presentations from companies like Boeing highlight FLEX Conference and Exhibition 2022, held in concert with the annual SEMICON West show this week in San Francisco’s Moscone Center. SEMICON West claims to be “North America’s premier microelectronics exhibition and conference,” uniting players across the entire electronics manufacturing and design supply chain.
Sean Nachnani, NextFlex
Emerging innovations in the flexible hybrid electronics (FHE) domain are enabling new applications across multiple industries due to their highly flexible structures and additive manufacturing processes. The smaller form factor, lighter weight, and conformal capabilities are ideal for IoT edge devices in health and fitness monitoring, military asset identification and tracking, automotive displays and sensors, aerospace radar, and soft robotics. Significant industry research led by NextFlex is optimizing the processes from design through manufacture for FHE products.