Rogers Corporation Highlights Advanced Materials at Defense TechConnect Summit & Expo


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Rogers Corporation will exhibit its advanced material solutions for Aerospace & Defense markets at the Defense TechConnect Summit & Expo 2022, Booth # 513, at the Gaylord National Hotel & Convention Center, in National Harbor, MD, Sept. 27-28, 2022.

Learn more about Rogers’ multilayer copper clad laminate solutions and formable/shaped dielectric systems designed to meet smaller size, weight, and power (SWaP) requirements in complex electronic assemblies; advanced magneto dielectric systems (MAGTREX® laminates) for impressive miniaturization of antennas and other electromagnetic (EM) assemblies; and novel dielectric composite materials for use in 3D additive manufacturing processes that can  expand the performance of antennas and sensor systems.  Rogers develops material solutions for enhanced signal integrity (SI), improved EM performance and thermal management of critical electronic applications.

Rogers Corporation continues to develop material solutions for the changing needs of electronic industries and will bring an experienced team of technologists to Defense TechConnect Innovation Summit & Expo to help present and enable prospective partners to meet and exceed their system requirements.  The popular expo is a global forum for Rogers to showcase their technologies, materials, engineering capabilities, and advanced solutions and invite in-booth discussions concerning the challenges posed by current and emerging applications, and how Rogers’ unique materials solutions can help overcome these challenges.

“Rogers’ commitment to the aerospace and defense electronics industry transcends our traditional laminate materials.  We are pleased to introduce to the innovation community the advanced material solutions and capabilities Rogers can employ to solve complex challenges faced by our partners.  I hope to see many of you at the show.” – John Ekis, Market Segment Director.

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