Strength in the Market for 2022 and 2023



In this conversation, Joel Scutchfield, general manager and sales director, discussed Koh Young’s growth and success through 2022 (as evidenced by their recent receipt of the same Service Excellence Award, two years in a row) and hints at some of what we can expect from Koh Young in 2023.

If you couldn't make it to Minneapolis for SMTA International, don't worry. Our Real Time with... SMTAI 2022 program features a variety of interviews with the industry's top engineers, managers and executives. 

Share




Suggested Items

The Critical Nature of High-performance Computing

11/30/2022 | Nolan Johnson, I-Connect007
Dale McHerron is senior manager at IBM Research and oversees heterogenous integration research. In his presentation, Dale spoke about the need to architect the next generation of AI systems, and what it means to the infrastructure to run AI systems at this high level of technology.

The ‘Intel’ on Advanced Packaging Options

11/29/2022 | Nolan Johnson, I-Connect007
Dr. Tom Rucker is vice president in technology development at Intel and was a keynote speaker at the IPC Advanced Packaging Symposium, which helped set the table for the rest of the agenda. Tom understands this “radical and seismic” shift in terms of technology and breaks down what it means for the semiconductor and PCB fab industries. There’s absolutely a place at the table for PCB fabricators, but what are the first steps?

Advanced Packaging Symposium: Looking in the Rearview Mirror

11/23/2022 | Nolan Johnson, I-Connect007
Matt Kelly had the vision and Jan Vardaman set the tone for the IPC Advanced Packaging Symposium, Oct. 11-13 in Washington, D.C. So, did they accomplish their goals? What were the real takeaways from the event, and what can we expect to see next? Spoiler alert: Matt and Jan came away impressed in more ways than one.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.