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PCB Technologies is proud to announce that the company has acquired the technology and the business activity of Galil Microwaves & Microelectronics Ltd., effective as of November 1st.
The acquisition involves shifting Galil's production, expert employees, and engineering activities into PCB Technologies state-of-the-art brand new facility in Migdal Ha’emek, Israel.
Getting hold of Galil’s technology completes the full cycle of their "all-in-one" capabilities in the fabrication of PCBs, as well as the design and manufacturing of substrate, microelectronics packaging, and electronic assembly.
They welcome the team of Galil and their customers to join PCB technologies and be part of iNPACK, their miniaturization and advanced packaging division. Galil's technology will create additional synergy and add value to the all-in-one solution and bring their customers faster time to market and cost reduction for new design and production.
Nolan Johnson, I-Connect007
Halloween is next Monday and parties will be taking place over the weekend, I’m sure. Here in the United States, at least, the “any-holiday-is-an-excuse-for-a-party” crowd has integrated Halloween, along with Valentine’s Day, St. Patrick’s Day, and Cinco de Mayo into wide-ranging opportunities for themed revelry. The news this week has been a bit crazy as well, though certainly not alcohol-fueled. There was a lot of important news and narrowing it down to just five was thought-provoking yet ultimately rewarding. Here then, are the five top pieces of news you shouldn’t miss this week.
Nolan Johnson, I-Connect007
In this interview, PCB Technologies CEO Oved Shapira discusses the company's move into advanced packaging and heterogenous integration. Shapira explains how substrates and advanced packaging fit into the PCB fab and assembly ecosystem, and makes the argument that an all-inclusive fabrication and assembly supplier can be of great value to customers in product development and small scale production.
Andy Shaughnessy, Design007 Magazine
Where did the year go? I can’t believe we’re planning our January and February issues now. It was 84 degrees most of last week in Atlanta, and now it’s 31. I guess I should take my Hawaiian shirts out of rotation! This week we have quite a variety of articles for you. It’s officially show time and the industry is back in business in a major way. We have some news coming out of last week’s advanced packaging event in Washington, D.C., and an article about navigating SMTA International, which opens on Halloween this year in Minneapolis. We have a great column on avoiding EMI with good routing strategies, and an article on electrically conductive inks. To top it off, I-Connect007 has published a new book, written by Matt Stevenson of Sunstone Circuits, that posits a new “design for”: Designing for Reality. If you’re a designer, isn’t designing for reality what it’s all about?