iNEMI Call for Participation: Hybrid PCBs for Next Generation Applications


Reading time ( words)

An increasing range of high-speed applications require low loss dielectric laminate materials within a printed circuit board (PCB) stack-up to achieve the required electrical performance. However, these materials are more expensive than standard loss materials. One solution to minimize cost is to selectively use lower loss material on only the layers that require higher performance and use cheaper material on layers that do not require high performance. This “hybrid” combination of laminate materials can provide the required electrical performance at minimum cost, but the combination of dissimilar dielectric materials has associated challenges for PCB fabrication that can negatively impact reliability if manufacturing processes are not optimized and/or the materials are in some way incompatible.

According to an iNEMI survey, determining material compatibility and minimizing warpage are among the greatest challenges in hybrid PCB manufacturing. iNEMI’s Hybrid PCBs for Next Generation Applications project, led by Sarah Czaplewski (IBM) and Steven Ethridge (Dell), will evaluate how placement of dielectric materials with dissimilar properties within a hybrid stack-up impacts PCB thermomechanical performance. The team will study the impact of the following parameters on via hole reliability and PCB warpage: 

  • Material placement within a symmetrical hybrid stack-up with materials having different properties such as CTE and/or gel point
  • Various ratios of dissimilar dielectric materials in a symmetrical hybrid stack-up (i.e., 25% material A & 75% material B; 50% material A & 50% material B, etc.)
  • Resin asymmetry in the stack-up

The results of this project will increase understanding of how hybrid stack-up designs influence PCB thermomechanical performance. OEMs and PCB manufacturers may use this information to improve stack-up designs to be more robust and reliable as well as reduce the number of design and test iterations, thereby saving cost and development time. Laminate manufacturers may use this information to help tailor resin systems for use in hybrid constructions to better support customer needs. 

Registration

This webinar is open to industry; advance registration is required.

Wednesday, December 7, 2022
12:00-1:00 p.m. EST (US) 
9:00-10:00 a.m. PST (US)
6:00-7:00 p.m. CET (Europe)

Share




Suggested Items

Ventec: Contextualizing the CHIPS Act

01/05/2023 | Nolan Johnson, I-Connect007
Nolan Johnson hears from Alun Morgan, Technology Ambassador at Ventec, and Mark Goodwin, Ventec’s COO, about the benefits and risks posed by new PCB-oriented legislation in the U.S. and Europe. Faced with a rapidly consolidating industry, especially in the face of mounting pressure from the Russia-fueled energy crisis, government intervention is a welcome prospect—as long as legislators are committed to addressing the full scope of the issue, including the supply chain’s migration to Asia. Ventec is hopeful that, having been called on to educate government officials on the challenges facing the industry, they will help spur future legislative changes that will protect and grow the industry’s interests.

Aismalibar: Cooling Off With Thermal Interface Materials

12/16/2022 | Pete Starkey, I-Connect007
Pete Starkey stops by the Aismalibar booth at electronica to hear from Uwe Lemke about the company’s plans to further expand its footprint in the Chinese PCB market and how evolving e-mobility constraints have propelled a growing demand for materials that can address electrical isolation and thermal conductivity concerns in high voltage battery systems. As always, Aismalibar is up to the task, having developed a new thin fluid coating technology that boosts the performance and reliability of any interface using the same foil-based technology that has long defined its impressive line of product offerings.

ICT Christmas Seminar 2022: The Caliber of a ‘World Cup’ Event

12/13/2022 | Pete Starkey, I-Connect007
Regardless of the potential distraction of the international football match between England and Wales in the World Cup competition, an enthusiastic crowd of PCB fans gathered in Meriden UK for the Institute of Circuit Technology Christmas Seminar, an eagerly-awaited networking opportunity that included a face-to-face industry welcome event and an outstanding technical programme. Guest speakers highlighted new technology in selective solder nozzles, flexible circuits, industry cooperation, and a greener future by recycling PCBs.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.