Ventec Expands Hydrocarbon PCB Laminate Range for High-end RF, Microwave Applications

Reading time ( words)

Ventec International Group Co., Ltd., has expanded its tec‑speed 20.0 range of hydrocarbon-based PCB materials with the new tec-speed 20.0 VTM1000i hydrocarbon laminate. Offering impressive thermal reliability and exceptionally high Dk (9.8) and low Df (0.0023) typically seen only in PTFE materials, this next generation hydrocarbon laminate presents the industry with a lower budget solution for high-end RF applications, including satellite communications and 5G RF use.

Designed for antenna and communication systems, radar, and aviation systems, tec-speed 20.0 VTM1000i is available in a range of dielectric thickness, with 0.38 mm through to 3.81 mm options and offers high decomposition temperature (Td) of 426°C.

Providing considerable power integrity benefits, the high Dk value (9.8 ± 0.0245 @ 10 Ghz) provides larger interplanar capacitance than other hydrocarbon laminates in this range, offering an alternative option for specific application in the microwave and RF industry previously available only through more costly PTFE laminates.

Manufactured at Ventec’s state-of-the-art facilities based in Taiwan and China, tec-speed 20.0 VTM1000i is available worldwide thanks to Ventec’s managed global supply chain, providing reliable disruption-free delivery in Asia, Europe, and the Americas.

“At Ventec we are constantly refining and improving our range to help our customers achieve their special and future performance goals. tec-speed 20.0 VTM1000i represents a top-tier option for use with satellite communications systems, GPS antennas, and other RF and microwave circuitry, and is an important addition to our tec-speed range,” commented Jason Chung, CEO of Ventec International Group. “We will be showcasing this new laminate worldwide at events throughout 2023.”

tec-speed 20.0 VTM1000i will debut at the IPC APEX Expo 2023 in San Diego on booth 419 from 24-26 January.

Additional content from Ventec International Group: 


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads For the Week

02/03/2023 | Nolan Johnson, I-Connect007
It’s Feb. 3, 2023—2/3/23—and now we know the results of yesterday’s Groundhog weather forecast straight from Gobbler’s Knob in Pennsylvania. Punxsutawney Phil says six more weeks of winter. If you’re watching the ongoing ice storms blanketing much of the United States at present, that seems like a safe bet. Also a safe bet is that the most-read news this week is IPC APEX EXPO related. Additionally, this week IPC published its EMS and PCB numbers for December. All told, lots of industry news to read this week.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/27/2023 | Nolan Johnson, I-Connect007
This week, the IPC APEX EXPO event has cast a long shadow across the news feeds. No, that’s not the right metaphor. No, not a shadow; shadows are dark. It would be more accurate to say IPC APEX EXPO cast a beam of illumination upon the news feeds for the electronics manufacturing industry. To that end, the APEX EXPO news makes a prominent appearance in this week’s editor’s picks.

It’s Here: The Launch of IPC Community Magazine

01/23/2023 | I-Connect007 Editorial Team
IPC Community Magazine launches today at IPC APEX EXPO 2023, both in digital and print form. It is now widely available for download at no cost. This magazine helps tell the stories of IPC, particularly for IPC members who use and interact with the trade organization. IPC worked closely with I-Connect007 (IPC Publishing Group) to develop the concept for the publication, and asked John W. Mitchell, president and CEO of IPC, to share a few thoughts as he looked at the magazine for the first time in print.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.