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iNEMI's Call-for-Participation Webinar Package Warpage Prediction and Characterization Project, Phase 6
December 26, 2022 | iNEMIEstimated reading time: 1 minute
iNEMI is continuing a series of projects addressing package warpage challenges with Phase 6 of the Package Warpage Prediction and Characterization project. Packaging technology is aggressively evolving to meet new user demands and requirements. Understanding the dynamic warpage characteristics of electronic packages is critical for seamless board assembly.
iNEMI has completed five projects addressing warpage metrology challenges, measured and tracked recent trends in package warpage, and identified gaps in warpage simulation. While the previous projects focused on organic substrate packages, Phase 6 will focus on panel level packaging with inorganic material, such as glass substrate or carrier. The project will continue to:
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Conduct dynamic warpage characterization of the latest advanced packaging technologies from real samples to track trends and the typical range of warpage
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Establish a reliable modeling framework to optimize package dynamic warpage simulation
Join our call-for-participation webinar to learn more about the project and how it can benefit your organization.
Registration
This webinar is open to industry; advance registration is required (see SMTA's website). Deadline for project sign-up is February 13, 2023.
Session 1
Tuesday, January 10, 2023
9:00-10:00 a.m. CST (China)
8:00-9:00 p.m. EST (U.S.) on January 9
Session 2
Tuesday, January 10, 2023
7:00-8:00 a.m. EST (U.S.)
1:00-2:00 p.m. CET (Europe)
8:00-9:00 p.m. CST (China)
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04/08/2024 | iNEMIThe International Electronics Manufacturing Initiative (iNEMI) announces results from its recent Board of Directors election. The consortium's members have added three new directors and re-elected three incumbents, effective April 1, 2024.
iNEMI Publishes Four Roadmap Topics
04/04/2024 | iNEMIThe International Electronics Manufacturing Initiative (iNEMI) announces the availability of the first roadmap topics in the new iNEMI Roadmap format. Printed circuit boards, sustainable electronics, smart manufacturing, and mmWave materials and test are now available online.
Best Papers from SMTA International Announced
02/02/2024 | SMTAThe SMTA is pleased to announce the Best Papers from SMTA International 2023. The winners were selected by members of the conference technical committee.
iNEMI Tech Topic Series: Counterfeit Components
11/24/2023 | iNEMIiNEMI Tech Topic Series: Counterfeit Components, Emerging Trends in Counterfeit Detection and Mitigation, will be held Thursday, December 7, 2023 / 11:00 a.m.—12:30 p.m. EST (US).
iNEMI & ZESTRON Workshop: Advanced Packaging and its Impact on mm/Wave Applications
10/18/2023 | iNEMIA workshop sponsored by iNEMI and ZESTRON Corporation will be held on November 7, 2023 at 9:00 a.m.-5:00 p.m.