New iNEMI Project on High Density Interconnect Socket Warpage Prediction

Reading time ( words)

iNEMI announces call-for-participation webinar on high density interconnect socket warpage prediction and characterization, phase 2 on January 5-6, 2023.

High-density interconnect sockets are becoming larger, which creates challenges for socket warpage simulation and can impact SMT assembly yield and reliability. Expedited computation that maintains the required level of accuracy is needed to shorten socket design cycles. 

Phase 1 of iNEMI’s High-Density Interconnect Socket Warpage Prediction and Characterization project established an analysis and validation framework for socket development, conducted simulation experiments, and initially investigated the impact of socket design, fiber filled material properties and molding process conditions on socket warpage.

Phase 2 will focus on improving socket warpage simulation accuracy and speed, further investigating the impact of molding and design on socket warpage, and will ultimately establish guidelines for dynamic socket warpage measurement and prediction. If you are involved in socket design and development, board assembly and/or reliability, this project will be of interest to you.  Please join us to learn more on January 5 or 6. The deadline to sign up for the project is February 17, 2023.

Registration

This webinar is open to industry; advance registration is required For additional information, visit iNEMI's website.

 
Session 1
Thursday, January 5, 2023
7:00-8:00 a.m. EST (U.S.)
1:00-2:00 p.m. CET (Europe)
8:00-9:00 p.m. CST (China)

Session 2
Friday, January 6
9:00-10:00 a.m. CST (China)
8:00-9:00 p.m. EST (U.S.) on January 5

12/27/2022 | Julia Gumminger, IPC

IPC members are constantly working to move the electronics industry forward by developing new technologies, innovative processes, and testing methods—and working to find solutions to known technical challenges. The IPC APEX EXPO Technical Conference is the premier forum in North America where these challenges, solutions, and innovations are shared among colleagues and competitors alike.

10/13/2022 | I-Connect007 Editorial Team

Summit Interconnect’s Gerry Partida recently spoke with the I-Connect007 Editorial Team about his research into root causes of weak microvias. Rather than a single manufacturing process cause, Gerry suggests that microvia reliability is the culmination of several material interactions and that contrary to popular belief, microvias can still be stacked in small, tight packaging densities. He highlights the need for simulation, as well as some of his findings that he plans to publish in a paper at IPC APEX EXPO 2023.

06/28/2022 | Pete Starkey, I-Connect007

At last, a live EIPC conference and this time in the Swedish city of Örebro, “where history and contemporary culture converge,” a pleasant and convenient location for an event that included a privileged visit to the Ericsson facility in Kumla. Around 100 delegates made the journey and the Örebro Scandic Grand Hotel was an excellent conference venue for the June 14-15 conference.