EIPC Winter Conference: Lyon, France Power Plant Visit Registration Ends Today

Reading time ( words)

France is evocative of many things, amongst them some classics: their cuisine, their architecture, their music. In the latter category, who has not heard the timeless “Songs from the Auvergne” by Joseph Canteloube. Who has not been to Lyon in the Auvergne Region?

If you wish to be part of another classic event, then please consider joining the EIPC Winter Conference which is to be held over two days, Feb 9-10, 2023, the first in the famous Groupama Football Stadium in Lyon, wherein The Kopster Hotel will be our overnight stay venue; the second will be at the Bugey Nuclear Power Plant. In the evening of the first day, we shall be dining, rather well, downtown Lyon centre.

The conference will have papers from Custer Consulting, EnergyVille, Ericsson, LiloTree, Trackwise, DP Patterning, Doosan, KLA, ASS Luippold, Dyconex, Suss MicroTec, Showa Denko, NanYa, and others. We will also be having a roundtable for environmental matters e.g., REACH SVHC solder mask restrictions, involving companies such as Agfa, Electra Polymers, Notion Systems, SUSS MicroTec, Taiyo, and Parachem.

In announcing this now we are mindful of the need to complete our registration by Jan. 6, as we are restricted to only 96 delegates for the visit to the Bugey Nuclear Power Plant. Please come and join us at what will be another memorable EIPC Conference, and Lyon in the winter is sublime. As for the gastronomy, we will find out.

Deadline for registration for the power plant visit: January 3, 2023.
Maximum number of visitors to the power plant: 96
Please be aware that Conference Day 2 including visit ends at 4 p.m. Feb 10.
We need to receive a copy of the passport of all visitors to the Bugey Nuclear Power Plant before Jan 3, 2023.


Suggested Items

Improved Thermal Interface Materials For Cooling High-Power Electronics

03/31/2022 | Jeff Brandman, Aismalibar North America
Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes were first used to receive and transmit data bits. The transistor and integrated circuit effectively solved that basic problem, but increases in integration resulted in increased concentration of heat, exacerbated by relentless increases in operating frequency. While improvements in electronics technology have been able to mitigate many thermal issues at chip level thanks to improved semiconductor designs devised to operate at lower voltages (thus requiring less energy) the thermal management challenge continues to vex electronic product developers.

Benchmarking Your Process Engineering

04/29/2021 | I-Connect007 Editorial Team
Mark Thompson has been in bare board fabrication for over 30 years. He is now laying out printed circuit boards at Monsoon Solutions, a high-tech design bureau near Seattle, Washington. With Mark’s extensive hands-on knowledge of PCB manufacturing, he brings a unique perspective to PCB design. In this discussion with the I-Connect007 editorial team, Mark shares what’s important from a process engineer’s point of view, and how to stay on top of evaluating and benchmarking your manufacturing process, along with insights from his new role as a designer.

PCB Requirements for E-Mobility

03/23/2021 | I-Connect007 Editorial Team
Nolan Johnson, Barry Matties, and Happy Holden speak with Christian Klein, section manager for PCBs in the automotive electronics division, about Bosch’s recent presentation on PCB requirements of the future in regard to automotive and electro mobility trends and challenges.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.