Ventec Launches Highest Thermal Conductive Metal Base Laminate for IGBT & Power Markets


Reading time ( words)

Ventec International Group Co., Ltd. is pleased to announce the launch of its latest high thermal conductive metal base laminate VT-4BC designed for use in applications requiring excellent performance in thermal management including super bright lighting, power modules, controllers, motor drives and rectifiers.

With high electrical breakdown strength, VT-4BC is designed to provide unparalleled reliability and improved performance over competing materials. It exhibits a thermal conductivity of 10 W/mK, offering superior heat dissipation even under the most demanding conditions.

In addition to its exceptional thermal performance, VT-4BC also boasts excellent mechanical properties, dimensional stability, and superior dielectric properties. It is also resistant to impact, moisture, and chemicals, making it a reliable choice for the most demanding applications particularly for IGBT and power markets.

The material will make its US debut at IPC APEX Expo 2023 from 24-26 January in San Diego, where visitors to booth 419 can discover the superior performance of VT-4BC alongside the full range of PCB base materials.

Ventec’s Global Head IMS Technology, Chris Hanson commented on the release of VT-4BC: “We are proud to introduce a product that provides unparalleled thermal performance and highest electrical breakdown strength. VT-4BC is designed for customers who value reliability and require improved performance over traditional materials. We look forward to showcasing it at IPC APEX Expo in January, where attendees can discover its superior capabilities firsthand.”

Share




Suggested Items

The Birth of the Printed Circuit Board

05/23/2023 | Barry Matties and Nolan Johnson, I-Connect007
Every industry has a beginning, and we are lucky to have Rex Rozario here to share the story of how the printed circuit board industry got its start. I-Connect007 chatted with Rex recently about how he became involved with circuit board inventor Dr. Paul Eisler.

EIPC Review: Ultra-high-density Interconnects, Thin-film Resistor Materials

05/10/2023 | Pete Starkey, I-Connect007
It’s been a little while since I first had the opportunity to review an EIPC Technical Snapshot webinar. This excellent series began in October 2020 when our industry was besieged by the COVID-19 pandemic. It has continued successfully as restrictions have lifted and provides an effective channel for the efficient sharing of relevant knowledge that complements the traditional live conferences. The 20th in the series, in December 2022, focused on environmental issues impacting the electronics industry. In early February, EIPC held its live Winter Conference in Lyon and now, by popular demand, the 21st Technical Snapshot fills a slot before the Summer Conference scheduled for mid-June in Munich.

A Quantic Leap into Foils and Embeddeds With John Andresakis

03/29/2023 | Andy Shaughnessy, Design007 Magazine
Andy Shaughnessy talks with John Andresakis about how the merger of resistive foil technologies from Ohmega and Ticer has evolved under the new ownership of Quantic. Andresakis also shares how these materials are finding new applications, especially in the embedded component application space, as the company reaches out to the new generation of PCB designers and design engineers.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.