EMC 800GbE Ethernet Solutions with New Material Offering at Designcon 2023


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At DesignCon 2023, drop by EMC/ Arlon booth #955 and learn from the experts with the results from a wide range of performance testing that some of our key OEM customers have completed. The company will highlight how their extreme low-loss solutions EM-892K and EM-892K2 materials continue to rise as the best in class for its loss group. 

They are formulated with a ruggedized resin foundation that enables continued solid performance through various thermal excursions.  They have withstood up to 7 lamination cycles for high density interconnect. The number of Tier 1 OEMs opting for this EMC’s 800G laminate solution for their next generation needs, has continued to grow.

EMC has also added another high-speed/low loss solution for Automotive Sector laminate needs. We have introduced the EM-A56 for next generation ADAS needs designed with 3.2 Dk/0.004 Df along with its enhanced very low Z axis CTE of 1.8%, sampling currently is available for testing. 

Another segment of Industry support by EMC taking shape is the IC Substrate sector.  With our EM-S530 and EM-S570 substrate materials, we are breaking grounds to be the first Taiwan based substrate material provider outside of the traditional Japanese brand dominance.

For dedicated mission critical PWB’s for military, aerospace, space, down hole oil and gas drilling, burn-in and automatic test equipment; Arlon’s introduced 86HP as the revolutionary addition to Arlon’s best-in-class high performance polyimide laminate systems engineered to meet high temperature, electrical and mechanical performance not found with any other polyimide resin system, also meets IPC-4101 slash sheets 40 and 41. 

86HP is designed for dense circuit configurations due to the Anti-CAF performance of over 1,000 hours at 85% RH/85⁰C/ 100V DC, low-Z-axis expansion of

For more information about Elite Materials please visit the EMC website at www.emctw.com.

For more information on ARLON EMD please visit www.arlonemd.com.

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