Summit Interconnect Inc. Chooses atg A9a Flying Probe Technology for High-speed Electrical Test and Automation

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atg Luther & Maelzer GmbH, confirms delivery of high-speed bare board testing technology to Summit Interconnect in Orange, CA.

Summit is the largest privately held PCB manufacturer with 8 facilities in North America and specializes in the manufacturing of advanced technology with focus on complex rigid and rigid flex products with unique expertise in RF / Microwave applications for the Commercial and Aerospace and Defense industry.

Consistent with the on-going investment in leading edge technologies at Summit Interconnect, the fully automated A9a, 8 head, double-sided, high speed, high accuracy flying probe test system represents the latest addition to Summit’s test department. The new atg technology enables Summit Interconnect to test ultra-fine designs while helping to reach industry leading automation goals.

atg’s A9a is able to test pad sizes down to 35 micron and is capable of testing products up to a size of 21” x 24”. The A9a eliminates limitations due to test point density or fine-pitch contacts and also features embedded component test, 4-wire Kelvin measurement capability with an accuracy of +/- 0,025 mΩ, HPOT and latent testing. In combination with a test speed of up to 230 measurements/second, the A9a provides a “lights-out” automated handling solution for larger production runs. To achieve high throughput the key feature of the A9a is a dual shuttle system, which reduces the product exchange time to zero seconds in automation mode. 

atg Luther & Maelzer GmbH, a member of Mycronic AB (Sweden) is the leading supplier of electrical testing solutions for the printed circuit board industry.


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