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Size reduction coupled with increased bandwidth is driving new and tighter PCB/FPC (flexible printed circuit) design requirements that may exceed the capability of fabrication processes used for previous generations of I/O connector interfaces. In short, connector land pattern tolerances drive process requirements not previously needed. An understanding of complex process interactions is necessary to identify processes to use, conduct risk assessment, and meet product quality requirements.
The purpose of iNEMI’s PCB Connector Footprint Tolerance project is to define methods that enable designers who are creating products with high I/O bandwidth connector footprints to use the collected industry capability and capacity data to determine appropriate mitigation for the required level of quality for a given product. This fast-turnaround project will:
- Provide better understanding of risks associated with high I/O bandwidth connector footprints
- Enable product designers to conduct risk assessments to determine optimum manufacturing processes to enable PCB suppliers to meet product quality requirements
- Reduce product qualification costs and associated time to market
Join us for our call-for-participation webinar to learn more about this new project. Two sessions are scheduled and are open to industry; advance registration is required, visit iNEMI's website.
Tuesday, May 9, 2023
11:00 am. — 12:00 p.m. EDT (US)
5:00-6:00 p.m. CEST (Europe)
Wednesday, May 10, 2023
7:00-8:00 a.m. CST (China)
7:00-8:00 p.m. EDT (US) on May 9
Andy Shaughnessy, Design007 Magazine
We recently held a roundtable with a team of printed electronic circuit experts from companies that run the gamut: John Lee and Kevin Miller of Insulectro, Mike Wagner of Butler Technologies, Tom Bianchi of Eastprint, and John Voultos of Sheldahl Flexible Technologies. In the first part of this roundtable, the team dispelled a variety of myths surrounding PEC. In this second part of the roundtable, the participants discuss what designers and fabricators need to know to jump into printed electronics, and some of the drivers behind this growing technology.
Sean Nachnani, NextFlex
Emerging innovations in the flexible hybrid electronics (FHE) domain are enabling new applications across multiple industries due to their highly flexible structures and additive manufacturing processes. The smaller form factor, lighter weight, and conformal capabilities are ideal for IoT edge devices in health and fitness monitoring, military asset identification and tracking, automotive displays and sensors, aerospace radar, and soft robotics. Significant industry research led by NextFlex is optimizing the processes from design through manufacture for FHE products.
I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Tara Dunn’s turn! Tara is the vice president of marketing and business development for Averatek. A regular Flex007 columnist, Tara discusses flexible circuits, rigid-flex, and rigid PCBs, as well as RF/microwave technology, microelectronics, and additive processes. She is also co-founder of Geek-a-Palooza and a show manager for the SMTA Additive Electronics TechXchange event. She has over 20 years of experience in the PCB industry. We hope you enjoy “Just Ask Tara.”