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MKS’ Atotech to Participate in JPCA Show
May 22, 2023 | AtotechEstimated reading time: 1 minute
MKS Instruments is excited to join the upcoming JPCA Show at Tokyo Big Sight held from May 31 to June 2, 2023. The team will represent our strategic brands, Atotech and ESI, and will introduce our latest products and manufacturing solutions for PCB and package substrate manufacturing.
MKS Atotech and ESI teams are represented by a select group of industry and technology experts from across various business sectors and can be found at booth 6B-11. We are looking forward to learn about your latest requirements and explain what we can do for you with our new combined product offering.
MKS is highly committed to driving next-level technological developments within its industries and key installations at our local TechCenter in Yokohama to support next generation package substrate development working towards meeting 5/5µm L/S targets. By combining leading capabilities in lasers, optics, motion, process chemistry and equipment, we are positioned to Optimize the InterconnectSM, a significant enabling point of next-generation advanced electronics that represents the next frontier for miniaturization and complexity.
Our show highlights include:
G-Plate: Vertical desmear and electroless HVM plating tool for next-generation high-end package substrates with well-organized particle control
Cuprapulse XP7-IN: Vertical pulse plating with inert process to improve thickness distribution, especially high and low TH density area and very suitable for inner layer of next-generation package substrates
NovaBond® EX-S2: Adhesion Promoter for the latest ABFs with zero-line width reduction and minimized surface nano-roughness. Very suitable for ultra-fine lines and high frequency applications due to its nearly impeccable signal integrity
Stanna-CAT: New autocatalytic tin bath with no thickness limitation and no selectivity of plated metal
Geode A: CO2 laser system for high precision and high-speed ABF build-up laminate processing
Capstone: Flex PCB UV drilling tool for high-performance breakthrough productivity
Conference: JPCA Show 2023
Date: May 31, to June 2, 2023
Booth: 6B-11
Venue: Tokyo Big Sight (East Exhibition Halls)
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04/09/2024 | DuPontDuPont introduced the DuPont™ Pyralux® ML Series of double-sided metal-clad laminates, a unique addition to its extensive family of Pyralux® laminates for flexible and rigid-flex printed circuit boards (PCBs).
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Designers Notebook: What Designers Need to Know About Manufacturing, Part 1
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