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TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies and printed circuit boards (PCBs) announces that it will exhibit at the 2023 International Electronics Circuit Exhibition (Shenzhen), at Booth #2C31 from May 24-26, 2023 in the Shenzhen World Exhibition & Convention Center (Bao'an), China. The theme of this year’s event is “Digitizing the Future”.
TTM will be hosting a series of technical seminars that showcase its cutting-edge engineering and product solutions aimed at addressing customer challenges across diverse end markets and applications. The scheduled seminars will cover trending topics, including updates on Communication & Computing Printed Circuit Boards, readiness for faster data speeds, and innovative Thermal Management Solutions.
As the world gradually returns to normalcy, TTM is pleased to participate in the return of the International Electronics Circuit Exhibition in Shenzhen after several years of pause due to the COVID-19 pandemic.
"We are thrilled to be a part of this important industry-recognized event, and we value the opportunity to engage with customers in person. Our goal is to exchange ideas on market trends and gain insights that will help us collaborate more effectively to succeed in the ever-changing electronics industry. We look forward to an amazing exhibition and welcoming all the visitors in Shenzhen this year," said Kent Hardwick, Senior Vice President, Global Sales and EMS at TTM Technologies.