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ASE Suspends FC Substrate Expansion Plan
December 26, 2007 | DigitimesEstimated reading time: Less than a minute
Advanced Semiconductor Engineering (ASE) has suspended a plan to expand its flip chip (FC) substrate capacity, revealing that it has laid off over 40 workers at its FC substrate plant at its Chungli production base in northern Taiwan. In April ASE said it planned to increase its FC substrate monthly capacity to two million units by the end of the year, but oversupply in the market prompted the company to reveal at an investors conference that it would put on hold its FC substrate expansion plan.Read This Article