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3D LDS Components: New Opportunities in PCB Layout and Production
November 4, 2014 |Estimated reading time: 1 minute
One clear trend has dominated electronic and mechatronic products for many years: Components must get smaller in size while also packing in more functions. Manufacturers in the communications technology sector are under tremendous pressure to continuously launch new products on the market at shorter and shorter intervals, to maintain their commercial positions. As if that were not enough, these new products have to stand out from the crowd by offering unique selling points. Innovative technologies such as molded interconnect devices (MIDs) enable new products to be produced with unprecedented functionality. And this is where LPKF’s LDS technology comes in because it opens up a huge opportunity for businesses that need very reliable and efficient production technology. Economic prototyping processes and a short production pipeline are also added advantages.
The current main application is the production of smartphone antennas. In the future, the German Research Association 3D-MID expects a significant growth in tablet or laptop antennas as well as new applications in the automotive and medical field.
Molded Interconnect Devices for Higher Function Density
MIDs allow the integration of electronic circuits and components directly on three-dimensional plastic components. This enables chips to be elegantly stacked in their assemblies, and the antennae in smartphones or netbooks to be incorporated directly within the housing, which saves a great deal of space. Integrating functions also decreases the number of individual components required, eliminates a whole range of production steps, automatically saves additional costs, and creates higher quality components.Read the full article here.Editor's Note: This article originally appeared in the September 2014 issue of The PCB Magazine.