Checking in with Fast Growing Bay Area Circuits

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Stephen talks with Guest Editor Dan Beaulieu about what's new at BAC, including their new 3-D soldermask machine that cures as it prints. With over 60% of their business in quick turn prototypes, process speed is top priority. 

Watch the interview here.

03/29/2023 | Pete Starkey, I-Connect007

At a recent industry conference, technical editor Pete Starkey caught some time with Ventec’s Mark Goodwin and Didier Mauve. In this conversation, Mark and Didier discuss Ventec’s work to curate their product offerings into functional categories based on function and target application. The pair also share their thinking on markets which they see as driving material development work. When material performance becomes an integral part of the PCB’s performance specifications, the traditional way of categorizing materials may not do the job.

02/27/2023 | Pete Starkey, I-Connect007

The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.

12/13/2022 | Pete Starkey, I-Connect007

Regardless of the potential distraction of the international football match between England and Wales in the World Cup competition, an enthusiastic crowd of PCB fans gathered in Meriden UK for the Institute of Circuit Technology Christmas Seminar, an eagerly-awaited networking opportunity that included a face-to-face industry welcome event and an outstanding technical programme. Guest speakers highlighted new technology in selective solder nozzles, flexible circuits, industry cooperation, and a greener future by recycling PCBs.