Reading time ( words)
News from the EIPC
- New IEC Standards
News from Germany
- SMT Hybrid Packaging 2016: Call for Tutorials open
- Schweizer Electronic boosts sales by 8.3% in 1H 2015
News from the UK
- ICT Evening Seminar, 22 September 2015
Printed Electronics News
- New battlegrounds emerge for conductive inks & pastes
- PCB prototyping evolves with a new wave of electronic printers
News from WECC Members
- News from IPC
Click here for the International Events Diary 2015
Click here to download the complete SpeedNews Issue 20
M. Özkök, S. Lamprecht, A. Özkök, D. Akingbohungbe, and M. Dreiza, Atotech Deutschland Gmbh; and A. Stepinski, Greensource Fabrication
The continuously evolving electronics industry environment is causing the development of various electrolytic copper processes for different applications over the past several decades. This article describes the reasons for development and a roadmap of dimensions for copper-filled through-holes, microvias, and other copper-plated structures on PCBs.
Pete Starkey, I-Connect007
Of all of the technical user presentations I attended at the AltiumLive design summit in Munich, the one I found most fascinating introduced an innovative technology that encouraged a bit of lateral thinking and appealed to my creative side: the IMSE, or injection-moulded structural electronics.
Gene Weiner, Weiner International Inc.
Rather than joining the annual forecast fray by attempting to provide guidance or guesses as to the outlook for the PCB and electronic assembly businesses in 2017, I thought I would provide a different year-end assessment. Here are a few thoughts for the New Year and beyond from a long-term colleague and friend of the past half century, Harvey Miller, electronics market researcher, consultant and founder of Fabfile Online.