IPC Brings Significant Changes and Clarifications to IPC-4101D


Reading time ( words)

If you need the most current specifications for PCB materials used in rigid or multilayered printed boards, then it is time to upgrade to IPC-4101D-WAM1. This newly revised standard brings critical updates to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards.

IPC-4101D-WAM1 delivers key updates for board designers, specifiers of board materials, and OEM’s who use and keep boards current with base materials used in PCBs. This revision:

  • covers requirements for laminate or prepreg base materials used primarily for rigid and multilayer printed boards for electrical and electronic circuits
  • contains 64 individual, keyword searchable specification sheets, including a brand new sheet that expands offerings for commercially available laminates and prepregs
  • clarifies what is stated in the original release of IPC-4101D for the FR-4.0 materials as “None” for inorganic filler content, now states “
  • adds table 3-10, Permissible Laminate Substitutions for Specification Sheets /21, /24, /26 and /30

This revision brings significant changes and clarifications. Learn more about how these updates can benefit you.

Upgrade to the IPC-4101D-WAM1

 

Share

Print


Suggested Items

An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards

07/12/2019 | Bhanu Sood, Michael Osterman, and Michael Pecht, Center for Advanced Life Cycle Engineering
Multilayer organic laminates, which make up over 90% of the interconnecting substrates in electronics (standard FR-4 represents 85% of the substrates used for laminates), can develop a loss of electrical insulation resistance between two biased conductors due to conductive filament formation.

Emma Hudson: From Tomboy to Tech Lead

06/21/2019 | Gen3
Interview between Emma Hudson and Gayle Paterson, founder of FLITE (Female Leaders in Tech, Everywhere).

Insulectro’s OEM Program: Time to ACT!

06/21/2019 | Nolan Johnson, I-Connect007
Ken Parent, Insulectro VP of sales and product management, discusses the current dynamics in the materials marketplace and how Insulectro is developing educational resources to help design teams and fabricators better understand the capabilities and features for the emerging laminate materials.



Copyright © 2019 I-Connect007. All rights reserved.