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IPC Lauds Launch of Flexible Hybrid Electronics Institute
August 31, 2015 | IPCEstimated reading time: 1 minute
On behalf of IPC – Association Connecting Electronics Industries® and an estimated 800,000 people employed in our 2,200 U.S. member facilities, we applaud the launch of the new public-private institute on flexible hybrid electronics in Mountain View, Calif. This new facility, which will contribute to America’s global competitiveness in manufacturing, is part of the new National Network for Manufacturing Innovation (NNMI), which IPC has strongly supported.
On Friday, August 28, U.S. Secretary of Defense Ashton Carter and Congressman Mike Honda announced that the Department of Defense awarded the lead role in establishing a Flexible Hybrid Electronics – Manufacturing Innovation Institute (FHE-MII) to the FlexTech Alliance. IPC has committed to join the FHE-MII, which will work on the technical and business challenges of flexible hybrid electronics, a significant area of interest to IPC members.
In recent years, IPC has been a strong supporter of the NNMI initiative. IPC played a lead role in promoting the Revitalize American Manufacturing Innovation (RAMI) Act of 2014, which authorized the NNMI and was signed into law by President Obama last December. IPC continues to urge the U.S. Congress to fully fund the NNMI, so that this advanced manufacturing network can achieve its full potential in driving and growing American innovation and jobs.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
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Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
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