eXception PCB Solutions Invests in Direct Optical Registration System

Reading time ( words)

UK-based eXception PCB Solutions have announced the purchase of a Direct Optical Registration™ system. The system, developed by DIS Inc. of Islandia, N.Y., increases layer-to-layer alignment accuracy for the company’s prototype, NPI and production-volume printed circuit board business.

Direct Optical Registration allows for optical alignment of inner layers during the lay-up process of multi-layers and sequential build-up technology, eliminating the need to manually punch and pin individual layers prior to lamination. Tolerance buildup and variability associated with traditional pin lamination systems is eliminated.

The DIS systems provides a range of process benefits

  • Optical alignment of multilayers & sequential lamination
  • Lay-up, layer to layer alignment and welding take place in one unit
  • Easily align thin cores (1mil – 25µm)
  • Provides the ability to fine tune the lamination press cycle
  • Ability to check the registration of welded panels before and after lamination
  • The engineer now has the data to determine what movement took place in the lamination cycle and make the necessary corrections
  • Minimised handling of layers in the process.

In addition Direct Optical Registration provides an opportunity to utilize X-ray inspection to quantify registration of welded mulit-layers prior to lamination. The panel can then be measured after lamination, providing the data to analyze the lamination process and take corrective actions if necessary.

About eXception PCB Solutions

eXception PCB Solutions is a European leader in time critical, leading edge PCB manufacture. Specialists in design and NPI to serial offshore production with best-in-class supply chain management. Exception supplies a global OEM client base supported by a dedicated design & manufacturing engineering team,  www.exceptionpcbsolutions.com.

About DIS Inc.

DIS Inc. is a worldwide leader in optical registration systems for the printed circuit board industry and an innovative producer of innerlayer/sub-lam registration and welding equipment.  DIS has developed Direct Optical Registration™, a new method of optically registering and welding innerlayers/sub-lam such that registration is improved by eliminating mechanical tooling, operational cycle times are reduced and process flexibility is increased all while significantly reducing operating costs.  For more information, visit www.distechnology.com.



Suggested Items

The Institute of Circuit Technology Annual Symposium 2018

06/18/2018 | Pete Starkey, I-Connect007
ICT technical director Bill Wilkie is well-known for choosing notable venues for Institute of Circuit Technology events, and his choice for this year’s Annual Symposium was the National Motor Museum, located in the village of Beaulieu in the heart of the New Forest, a national park in the county of Hampshire in Southern England. The region is known for its heathland, forest trails and native ponies.

Show & Tell: Corporate Awards Bestowed by IPC

04/03/2018 | Patty Goldman, I-Connect007
Every year IPC recognizes two companies that have made significant contributions to IPC and the electronics industry. These awards are named after industry executives who were themselves significant and outstanding contributors: one for a PCB fabricator company and one for an electronics manufacturing services (EMS) company. This year’s recipients were Northrop Grumman and Rockwell Collins, respectively.

Weiner’s World—December 2017

01/02/2018 | Gene Weiner, Weiner International Inc.
Hold on to your seats! 2018 will be a year full of rapid changes, surprises, and growth. M&A activities will flourish. The supply chain will suffer shortages and changes as demand increases, copycats will rush to market, and new markets and potential suppliers will vanish before they are established.

Copyright © 2019 I-Connect007. All rights reserved.