Arlon Electronic Materials Announces Reintroduction of 85NT


Reading time ( words)

Arlon is reintroducing 85NT, a nonwoven aramid laminate and prepreg system.  Arlon’s 85NT is comprised of high tensile strength, para-aramid fibers with an extremely low coefficient of thermal expansion (-4 ppm/oC). When coated with resin, this combination of aramid substrate and thermoset chemistry produces laminates with unique and useful properties. Proprietary chemistry and process technology enables Arlon to coat polyimide and epoxy based resins on the nonwoven aramid. With a combination of material science and coating technology, Arlon reintroduces to the design and fabrication community 85NT laminate and prepreg product line. Arlon’s “new” 85NT has properties that are nearly identical to Arlon’s original 85NT.

  • Low in-plane (X,Y) expansion of 7-9 ppm/°C
  • Tg of Pure Polyimide (250oC)
  • Excellent dimensional stability and enhanced registration
  • Decomposition temperature of 426°C offering outstanding high-temperature life
  • PCBs typically 25% lighter in weight than conventional glass-reinforced laminates
  • Laser ablatable for high speed formation of microvias as small as 25μm
  • Electrical and mechanical properties meeting the requirements of IPC-4101/53
  • Compatible with lead-free processing
  • RoHS/WEEE compliant

For additional information contact Arlon customer service at our Rancho Cucamonga Manufacturing and Service Center at 909 987-9533, or visit our website at http://www.arlon-med.com.

Share

Print


Suggested Items

Vertical Conductive Structures, Part 1: Rethinking Sequential Lamination

05/13/2019 | Joan Tourné, NextGIn Technology BV
Sequential lamination, as it is used today in high density interconnect (HDI) and derivative technologies, is constrained by the fact that one cannot plate a blind hole deeper than the diameter of the hole. A larger hole allows processes to plate deeper. In fact, this manufacturing constraint has made it a challenge even to reliably plate and process blind holes up to a 1:1 aspect ratio.

Staying Current on Flex Manufacturing is Smart Business

04/04/2019 | Barry Matties, I-Connect007
Brendan Hogan, managing director of smart electronics manufacturer MivaTek Global, discusses how to better design for flex, and ways designers can stay current on manufacturing technology that can impact their flex boards.

Automation on Full Display at Recent China Exhibitions

04/01/2019 | Barry Matties, I-Connect007
With the rising cost of labor in China, the growing demand for automation has never been stronger. At the recent productronica China 2019, and accompanying shows, one hall was packed full of automation technology. This video gives you a glimpse into what was on display… and the new workforce.



Copyright © 2019 I-Connect007. All rights reserved.