-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Rogers Offers Design Support on Power and Thermal Management
January 21, 2016 | Rogers CorporationEstimated reading time: 2 minutes
To assist engineers in achieving optimum performance and cost-effective results with these materials, Rogers PES hosts an information-packed Design Support Hub at www.rogerscorp.com/designhub. This free design and application technology center is available 24 hours a day, 7 days a week for visitors to the Rogers Corp. website.
Rogers Corporation’s Power Electronics Solutions (PES) group provides high-power and thermal management materials solutions with its ROLINX and curamik product lines.
Rogers PES Design Support Hub Resources
The PES Design Support Hub helps design engineers increase the power-handling capabilities, improve thermal management, and enhance the quality and reliability of their circuit designs via highly focused technical guidance and information. The PES Design Hub includes technical papers, product data sheets and brochures, instructional videos, and the unique PES University training program. These educational opportunities are based on PES’ various advanced power-handling and thermal-management materials and extend across all areas of electronics, from analog to digital devices and circuits, from audio through microwave frequencies, and from DC converters and batteries to microprocessors.
Technical literature available at the PES Design Support Hub includes reports on silicon nitride (Si3N4) substrates for power electronics and lifetime testing of laser diode coolers. Additional downloadable literature features data sheets and brochures on Rogers ROLINX and curamik material solutions for power handling and thermal management as well as design rules for the optimum use of specific material solutions, such as curamik ceramic substrates and DBC coolers and ROLINX busbars. Videos include a presentation on ROLINX busbars at PCIM Europe 2015 and PES capabilities videos in English, Japanese, and Chinese.
Registration for the PES Design Support Hub is free and easy, at https:www.rogerscorp.com/designhub. It simply requires basic identification such as name and address and a password for future access, and takes, at most, about 1-2 minutes to complete. Once registered, a visitor can access the many educational opportunities at the PES Design Support Hub at any time, and download the many articles, papers, data sheets, and brochures as PDF files for future use.
Page 1 of 2
Suggested Items
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in