-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Altium to Release Integrated Documentation Solution for Altium Designer
March 31, 2016 | PRWEBEstimated reading time: 1 minute
Altium is scheduled to release a new documentation workflow available exclusively in their flagship PCB design platform, Altium Designer 16.1. Draftsman™ provides PCB designers with a unified documentation solution with customizable drawing views, documentation templates, and a fully complete design to documentation workflow in Altium Designer 16.1.
“Engineers have long relied on tools for documentation that are cumbersome and limited in functionality,” said Alexey Sabunin, Altium Designer Product Manager. “Draftsman™ eliminates the tedium of having to import and export design files to 3rd party tools and integrates the PCB design and documentation workflows in the Altium Designer interface. That’s one less interface for engineers to have to navigate and one centralized location for all PCB design and documentation data.”
Streamlining Documentation Workflows
Documentation is a critical element of every post-design process, and designers frequently struggle with limited, 3rd-party documentation tools that lack a connection to their original design. Draftsman™ links directly to a designer’s PCB data, making it easy to create and update assembly documentation directly within a design workspace without ever having to import or export files between third party solutions. With Draftsman™, PCB designers can:
- Avoid third-party tools - Create and update assembly documentation without having to waste time importing and exporting design files among multiple tools.
- Communicate better - Quickly communicate design intent to manufacturing with easy-to-use design markup and drawing object tools.
- Define their details - Provide detailed perspectives on design intent with flexible board views with expressive call-outs.
All of these features and more are available directly within a PCB designer’s workspace in the unified environment of Altium Designer 16.1. With a fully unified solution for both design and documentation, engineers can stay efficient without having to add another software package and interface to their existing electronics design workflow.
Availability Details
Draftsman is one of the several new features in Altium Designer 16.1, a major update to the company’s flagship PCB design tool. Altium Designer 16.1 is scheduled to be released on May 2, and designers can register now for a free webinar and learn more about Draftsman by clicking here. Altium will also be in attendance at the annual Embedded Systems Conference in Boston at booth 865 to show off all the new improvements being added to Altium Designer 16.1.
Suggested Items
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.