-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Cicor Names Alexander Hagemann New CEO
August 19, 2016 | CicorEstimated reading time: 2 minutes
Cicor is reshaping its management structure by moving to a simpler, more customer-oriented structure and reduced complexity with the goal to create a framework for enhanced future success. With this new organization, the Cicor Group positions itself for long term success and sustainable organic growth. In the new organization the positions of Head of Divisions AMS and ES are dissolved. In addition, the Board of Directors is announcing today that Alexander Hagemann has been appointed as Chief Executive Officer (CEO) per 1 September 2016. The current CEO will leave the Cicor Group.
The Cicor Group Management is changing. The CEO, Dr. Jürg Dübendorfer, the Head of the Division Advanced Microelectronics & Substrates (AMS), Jürgen Steinbichler, and the Head of the Division Electronic Solutions (ES), Erich Trinkler, will all leave the Cicor Group.
The newly appointed CEO, Alexander Hagemann, will join Cicor on 1 September 2016. Mr. Hagemann has profound experience in the operational management and has a well proven track record in setting up and growing businesses, especially in the Asian and North American markets, which are of particular importance for the Cicor Group. From March 2007 to July 2016 he was CEO at Schaffner Group. Earlier in his career Alexander Hagemann has been Executive Vice President for the Optics for Devices business segment at the globally active Schott Group and he also took up a post at BMW in the field of production and logistics.
Until 1 September 2016 Patric Schoch, CFO of the Group, will take over as CEO ad interim.
As new management structure a Leadership Team has been appointed, comprising of CEO, CFO and the Sales-, Technology- and Production responsibles of the Cicor Group. With this change the market experience and the operational skills of the extended Group Management are put on a broader base.
"With the formation of a highly experienced and strong leadership team with a broad operational understanding, Cicor accelerates its decision-making and implementation - for the direct benefit of our customers and to promote our own, faster development", says the Cicor Chairman Heinrich J. Essing.
Reducing complexity and clear responsibilities
Today’s communicated changes are a turning point for Cicor. The new structure meets the high expectations of customers, employees and shareholders.
The new management structure is more flexible, creating a shorter connection between the Group Management, the legal entities and the employees. The Group companies and their employees have all the necessary freedom to develop their business within a clearly defined framework and based on a unified vision for the entire Cicor Group.
From this more direct organization and management structure, Cicor also expects clearer responsibilities, more efficient processes, more direct communication and stronger customer focus and customer proximity. Abandoning complex matrix organizations and the direct involvement of the company leaders will have a positive effect on the success of the Cicor Group.
"Cicor is a healthy company with excellent employees around the globe and an excellent technology portfolio. I count on everybody working together for our future success," says Heinrich J. Essing.
The Cicor Group will continue to offer the right solutions and services and to support its customers with innovative technologies and outsourcing possibilities, globally and locally.
Suggested Items
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering
09/18/2023 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
09/18/2023 | IntelIntel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.