Cicor Publishes 11th White Paper: 'Ultra High-Density Interconnect Printed Circuit Boards'

Reading time ( words)

Further miniaturization of electronic devices of many kinds and a higher level of integration require a different approach for the manufacturing of printed circuit boards. Electronic components and packages are still getting smaller almost every year. According to Moore’s law, a doubling of the number of components per integrated circuit is happening every 24 months. To make best use of this development, more densely packed printed circuit boards are needed.

This need is rapidly increasing in many business segments. Miniaturisation is required in all dimensions, not just pattern density in x and y, but also thickness of circuits is of high importance. Currently used techniques have reached their limits, or will reach them within the next few years. New manufacturing processes or a new combination of processes will be required to fulfill these needs and keep costs under control. Potential approaches to produce these type of ultra high-density circuits are discussed in this paper.

To view white papers, click here.



Suggested Items

How to Feed Test Data Back to Engineering for Process Improvement

08/01/2019 | Todd Kolmodin, Gardien Services
Some people think of the PCB manufacturing process as a black box: design data goes to the manufacturer (fabrication house), and magically, the finished PCB is produced. While it may have been like that in the past, in actuality, fabricating PCBs today is quite a ballet of processes.

A Guide to High-reliability PCBs from Design to Specification

07/24/2019 | Jeff Beauchamp, NCAB Group
Creating reliable PCBs is an outcome of considering all aspects that can affect reliability as early as possible in the design process. The further down the design process, the more expensive and risky it can be to fix. As they say, everything starts with the design. Because a good board design improves the reliability of the end product and lessens the risk of failure.

Nano Dimension CEO Gives Company Update

07/19/2019 | Nolan Johnson and Dan Feinberg, I-Connect007
Dan Feinberg and Nolan Johnson speak with Amit Dror, CEO of Nano Dimension, about recent company events and the company’s focus on high-mix/low-volume and agile local manufacturing.

Copyright © 2019 I-Connect007. All rights reserved.