Averatek’s A-SAP Semi-additive Process Enables HDI
In this video interview from the show, columnist Tara Dunn spoke with Mike Vinson, president and COO of Averatek, who described the company's semi-additive process, A-SAP, with 25-micron features sizes and below, which enables high-density interconnections. Vinson also discusses the papers Averatek presented at IPC APEX EXPO 2020.
When Your Fabricator Is Late
The I-Connect007 Editorial Team recently had a wide-ranging discussion with John Watson, CID, of Legrand. Questions covered include, “What happens when your fabricator is late, whether it’s a prototype or volume production?” and, “What are the costs and ramifications up and down the chain?”
One Year Later: IPC Education Foundation Update
In this video interview from IPC APEX EXPO, Aaron Birney, education program manager for the IPC Education Foundation, speaks with Guest Editor Steve Williams about the foundation's focus on STEM, its growth over the past year since launching at IPC APEX EXPO 2019, and how IPC members can get involved and sponsor student chapters.
Shaun Tibbals Discusses Electra’s Continued Growth
In this video interview from the show, Guest Editor Dick Crowe speaks with Shaun Tibbals, sales and marketing director at Electra, about inkjet printing as opposed to conventional approaches, such as curtain coating and/or screen printing. Benefits involve the economical use of materials and zero VOCs. Shaun also explains the company's approach to serving the PCB and semiconductor segments.
IPC APEX EXPO 2020 Attendees Speak: Katie Carl
"We have a wide range of kids. All of them have some sort of interest in technology, which is why they wanted to come in general," said Katie Carl, a high school teacher escorting a group of kids at IPC APEX EXPO. "It’s neat when they start seeing how these technologies are created because a lot of them have seen robotics or have done a tiny bit of soldering with little circuits, but when they can see how those things are built and created in the industry, it makes it more applicable for them."
‘A Night of Happy-ness’ and 2020 Good for the Industry Awards
The Horton Grand Hotel in San Diego was the site of “A Night of Happy-ness” on the evening of Monday, February 3, 2020. I-Connect007 transformed the Regal Ballroom into a cozy lecture hall with two key objectives: to award the I-Connect007 Good for the Industry awards, and to celebrate the life, achievements, and personality that is industry pioneer Happy Holden.
EIPC Winter Conference: Business, Technology, and Community
Managing Editor Nolan Johnson recently spoke with Kristen Smit-Westerberg about the upcoming EIPC Winter Conference, February 13−14, 2020, in Rotterdam.
IPC Validation Services: What to Expect at IPC APEX EXPO 2020
IPC’s Randy Cherry previews what to expect from IPC APEX EXPO 2020, including a full line on display demonstrating CFX/Hermes, further development of the Validation Services program, as well as testimonials from member companies that have been participating in IPC’s new trusted supplier program to the Department of Defense (DoD).
Streamlining Inspection and Verification
Barry Matties speaks with Vladi Kaplan, VP of marketing for CIMS, about the company’s newest verification station, the benefits operators will see from its colorized real-time video, and how it makes verification much faster and much more efficient for companies pushing 100% inspection.
CES Slideshow: The Future Is Now
During the Consumer Electronics Show in Las Vegas, Nevada, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers. Enjoy this slideshow from CES week.
Ivanka Trump CES Keynote: The Path to the Future of Work
The Palazzo Ballroom at the Venetian Hotel and Casino was the site for one of the most anticipated keynotes at CES on Tuesday afternoon. CTA CEO Gary Shapiro moderated a conversation with Ivanka Trump, advisor to the President of the United States. The two discussed the current state of the workforce, higher education, skills retraining, alternatives to university education, and immigration. These are all topics that have been under discussion within the electronics manufacturing industry for some time now.
Ledia 6 Direct Imaging System Offers Enhanced Speed and Precision
Technical Editor Pete Starkey recently met with Ucamco’s Michel Van den heuvel, imaging product group director, to discuss the benefits of the Ledia 6 direct imaging system, which was introduced earlier this summer and features scan-alignment and improvements in registration and positioning accuracy.
Wi-Fi 6: Wired vs. Wireless
We all know that it makes no sense to get the latest device just because they come out with a new one every year. Sure, post-millennials tend to want a new phone every year, but most of us are well past that. However, as the competitive nature of the consumer tech industry continues to increase, the rate of change is also accelerating, as is the peer pressure to upgrade. Non-techies get new phones every year, techies get new CPU and GPUs every two years, average consumers get bigger and higher-res TVs every three years, and on it goes.
Electra Polymers: Inkjet Soldermask is Ready, Reliable and Green
Editor Pete Starkey and Tibbals discuss Electra Polymers’ move into the inkjet soldermask market, and some of the challenges and benefits of this technology. Tibbals explains how inkjet soldermask can enable end-users to improve reliability of the final product, for instance, because this additive process allows manufacturers to control the thickness of soldermask around vias and BGAs and eliminating trapped chemistry in undercut areas.
Pluritec Takes Industry 4.0 to the Next Level
Pete Starkey and Pluritec’s Nicola Doria, president and CEO, discuss how the structure of Pluritec has developed over the past few years, now including many respected brand names that are long familiar in the PCB fabrication segment. Doria also explains how the company is continuing its implementation of Industry 4.0 processes.
Nolan’s Notes: Clarity of Vision
In this issue, we update your prescription, clarify your vision of the industry, and bring your own perspective into view. With each interview, try on another outlook and look at the industry from another point of view.
Sunstone Circuits on Staffing Trends in the Digital Age
Sheri Kuretich, human resources manager, and Nancy Viter, VP of operations, of Sunstone Circuits speak with Nolan Johnson about what they see from the perspective of a prototyping shop, the current state of the hiring market, and how they have used ISO 9000 as an information repository to pass technical knowledge from experienced employees to newer ones.
Industry Wind Vane: Future Development Through the 2019 HKPCA Show
The annual HKPCA Show, which has been renamed the 2019 International Electronics Circuit Exhibition (Shenzhen), will be held from December 4–6 at the Shenzhen Convention and Exhibition Center. This year’s exhibition will be jointly organized by the Hong Kong Printed Circuit Association (HKPCA) and the China Printed Circuit Association (CPCA) and will provide a more efficient business platform for all visitors. The PCB007 China Team interviewed a representative from the HKPCA about the exhibition, the industry’s current situation, and future developments.
Solder Mask Tack Dry
As a general rule, the tack-dry temperature should be as low as possible; in other words, it should only be as high as necessary. If the temperature is too low, the evaporation rate for the solvent will be to slow, and the solder mask will not dry in a reasonable amount of time. If the temperature is too high, however, the dry time certainly will be excellent, but it could create a solder mask lock-in with repercussions by the developing time.
Can E-waste and Metals Recovery Efforts Lower Environmental Risks and Liability?
Gold, palladium, silver, and other precious metals (PMs) in manufacturing wastes represent high value, but how PMs are recovered can pose environmental and liability issues. Aerospace and electronics manufacturers and suppliers, in particular, produce volumes of manufacturing wastes that contain varying levels of PMs.
Innovator Bob Tarzwell Retires From PCB Industry to Focus on New Career in Art
I have known Bob Tarzwell for more than 18 years, since he first called me looking for some help with his company. His first words to me were, “Hi, my name is Bob Tarzwell and I own a shop in Carleton Place, Ontario. I need your help."
Karl's Tech Talk: Green Legislation and the Impact on Electronic Materials and Processes
In general, “green” and “environmentally friendly” refer to manufacturing that involves the replacement of toxic substances with less toxic materials, the elimination of materials or processing steps, less consumption of chemicals (i.e., more efficient or higher yield processing), reduction of water use, reduction of energy use, less space requirement (i.e., smaller equipment footprint), recycling, and on-site recovery of materials.
IPC APEX EXPO: IPC's Fern Abrams Provides Updates on RoHS, REACH Directives
Fern Abrams, director of regulatory affairs and government relations at IPC, discusses with I-Connect007's Stephen Las Marias the latest updates on the changes happening in the RoHS and REACH directives this year, as well as IPC's new initiatives and advocacies.
Book Review: Meetings That Get Results
In this short but amazing book, Brian Tracy covers all types of meetings, from the large training sessions to the one-on-ones. He even describes how you should be sitting when having a one-on-one meeting (each of you at a corner of the table), how to get your point across, and how to listen.
Fire Retardancy: What, Why, and How
This article takes a critical look at all aspects of fire retardancy, starting with the need for fire safety, the function of a flame retardant, the reactive and additive flame retardant classes, major flame retardant compounds, toxicology and environmental impact of retardants--most especially Tetrabromobisphenol-A, which is the most widely used flame retardant in PCB materials--as well as European legislative directives.
Aluminum Base Circuit Technology: Structures and Manufacturing Methods
Aluminum is an attractive material for use in the manufacturing of electronic assemblies due to its low cost, good thermal properties, and stability. But due to its innate thermal spreading ability, it's not easily used when solder is required to make interconnections to components. This article describes ways to manufacture electronic assemblies using aluminum as a base and eschewing the use of solder.
Sustainability: What and Why?
Joe Fjelstad writes, "The resources of our planet are limited and thus are diminishing as we continue to unleash and ramp-up a seemingly never-ending flow of products to both serve and amuse us with output of the global electronics industry likely to be nearing the top of the list of 'offenders.' In that regard, we are becoming victims of our own success, to one degree or another."