AltiumLive Summit—Munich, Germany, Part 2

Pete Starkey continues with his review of the AltiumLive PCB Design Summit held recently in Munich, Germany. The second day commenced with a new product launch. “Working together is hard” it read on the screen. Statistics indicated that 33% of new products were late getting to market, of which 28% were late due to insufficient collaboration, and up to 50% of potential revenue could be lost through being late to market. Then the screen read “NEXUS makes it easy!”

Weiner’s World—August 2017

IPC is planning to hold a special meeting on automotive electronics for senior executives during IPC APEX EXPO 2019. The meeting will be planned and produced by the IPC Ambassador Council. Its presentations will feature senior members of the entire automotive electronics supply chain.

Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1

Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.

Innovator Bob Tarzwell Retires From PCB Industry to Focus on New Career in Art

I have known Bob Tarzwell for more than 18 years, since he first called me looking for some help with his company. His first words to me were, “Hi, my name is Bob Tarzwell and I own a shop in Carleton Place, Ontario. I need your help."

American Standard Circuits Discusses e-Book on Designing Flex and Rigid-Flex

American Standard Circuits is an industry leader when it comes to high-technology printed circuit boards, especially flex and rigid-flex printed circuit boards. So, it was natural that they would write about flex and rigid-flex for I-Connect007’s new “Guide to…” e-book series.

EIPC 2017 Winter Conference Review of Day 1

Themed to address the question: “The Future Needs of the Global Electronics Industry: What Solutions will Europe Provide?" the conference was a truly international event, attracting delegates from thirteen countries, to hear a well-chosen programme of twenty presentations in five sessions, introduced by EIPC Chairman Alun Morgan.

TTM SJ Hosts IPC Designers Council Meeting

The Silicon Valley Chapter of the IPC Designers Council was treated to a delicious barbecue lunch on October 13 at TTM’s San Jose facility. About 20 PCB designers and support professionals gathered for the tri-tip lunch-n-learn conference.

All About Flex: FAQs on RoHS for Flex Circuits

In 2003, the European Union (EU) adopted a standard called the Restriction of Hazardous Substances (RoHS), which restricts the use of certain materials in electronic products and electronic equipment. The intent is to reduce the environmental impact of known hazardous materials and has driven changes in manufacturing processes and materials used to manufacture a wide array of electronic products.

Alun Morgan on the EIPC Summer Conference 2016

Each year, the EIPC puts on two conferences for their members. I recently attended their summer conference in Edinburgh and had a chance to speak with EIPC President Alun Morgan about the topics covered at the conference and the connectedness and networking that is always present at EIPC events.

Book Review: Beating the Workplace Bully

There’s the woman who conned her co-worker into buying her coffee on the first day and then made it a daily event. Or the boss who was always threatening to fire his staff and telling them, “There’s blood in the water.” Or the supervisor who told her new employee on the first day that it was not her choice to hire her, because she had only worked in a small firm and “did not have the sophistication this corporate position needs. You don’t even dress properly.” This great book is full of such terrible people.

Flex Talk: Inaugural West Coast Geek-A-Palooza a Fun-filled Success!

Geek-A-Palooza kicked off the 2016 schedule May 12 in Irvine, California. Historically, Geek-A-Palooza has been held in Minneapolis but is expanding this year to include Orange County and Boston as well.

All About Flex: Flexible Circuits and Kaizen Events

All Flex uses a variety of different tools and techniques in its continuous improvement efforts. A Kaizen event or Blitz is one technique that has resulted in significant improvements in our yields, productivity and customer satisfaction.

Happy’s Essential Skills: Technical Writing

Technical writing is one of those topics that they don’t really talk about in college—at least not where I went. Writing and English has never been a strong like of mine compared to science and math. So I did my required time in English and wrote my lab reports the best I knew how.

Interview with Dean Kamen, Segway Inventor and Founder of FIRST

One of the keynote speakers at this year’s IPC APEX EXPO 2016 was Dean Kamen, inventor of the Segway and hundreds of other innovative devices. But perhaps most importantly, Kamen is the founder of FIRST (For Inspiration and Recognition of Science and Technology), which is recognized as the leading not-for-profit STEM engagement program for kids worldwide.

Book Review: Mark Goulston’s “Talking to Crazy”

We call know crazy. We all know people who are somewhat irrational or even completely bonkers! But we don’t know how to deal with them, right? Well, put that in the past tense. We did not know how to deal with them until this new book came along.

Dan Beaulieu's 'It’s Only Common Sense' Celebrates 500th Column

“We’d like to congratulate Dan on his 500th column,” said Publisher Barry Matties. “Dan is a strong advocate for smart business. We thank Dan and look forward to 500 more columns, and you can be sure that Dan will keep stirring the pot.”

CES 2016 Wrap-Up, Part 1

CES 2016 is now history and most of us are home, or at our next port-of-call. I have seen various attendance numbers but it’s somewhere in the range of 175,000; it was busy, crowded and impossible to see everything. Here is my review of some of the most innovative devices and technologies at CES.

Flex Talk: Thoughts on the IPC Flexible Circuits–HDI Forum

As an attendee at the IPC Flexible Circuits–HDI Conference held October 28–30, I found myself in a room full of people, all eager for technical information, with the opportunity to reconnect with industry friends and to make new connections. The audience was diverse with young people, new to our industry, sitting alongside industry veterans willingly sharing their knowledge and passion for HDI design and flexible circuit technology.

The War on Process Failure

Who out there thought of it as a war? Is it? Well, we think it is—and a never-ending one at that. In fact, we thought it significant enough to devote all three of our August issues to the subject, because no matter how good you are or how great things are running, Murphy’s Law is right there, ready to take you down a peg or two—or worse.

Innovative Technologies Drive PCB Industry Growth

PCB growth has slowed in recent years, though last year the growth rate was slightly higher than the 2% of the last three years. Estimates by IEK of Industrial Technology Research Institute of Taiwan show that the PCB industry will continue to grow in 2015 at a rate of 3-5% with an annual output of RMB 576 billion (USD 93.8 billion).

EIPC Summer Conference: Day 2

Refreshed after an excellent conference dinner, and for most, a good night’s sleep, delegates returned for the second day of the EIPC Summer Conference in Berlin, continuing the theme of improving profitability through technical leadership and innovation to meet future market requirements, with sessions on materials and processes for high performance PCBs and advanced material testing strategies to meet OEM and ODM needs.

EIPC Summer Conference, Berlin: Day 1

Berlin, capital of Germany and a world city of culture, politics, media and science, was the venue for the 2015 EIPC Summer Conference, which attracted delegates from sixteen countries, including Russia, Hong Kong, Japan, Israel, USA and Canada, as well as the European Union, to experience a programme of 21 technical presentations over two days. Also included was a visit to the Berlin laboratories of Fraunhofer Institute, Europe’s largest application-oriented research organisation.

HDPUG Demonstrates Benefits of Cooperative R&D

The High Density Packaging User Group (HDPUG) is a member-driven, non-profit, project-oriented industry consortium that addresses the integration of new electronics component packaging and interconnection technologies into the supply chains of its member companies.

Three Industry Giants From WKK Gather Around for Discussion

During the recent HKPCA show we sat down with Hamed El-Abd, Lionel Fullwood, and Gene Weiner. Our discussion covered an array of topics, from politics to new PCB factories and what it takes to stay competitive in today's market.

Social Media 101: Eight Website Questions Answered

For now, forget Twitter and Facebook. Forget YouTube and LinkedIn. Forget Google Plus and Pinterest. Forget Slideshare. The absolute first thing you need to succeed in social media is a good website.

I-Connect007 Announces Exclusive Interview

"As you can imagine, we are quite excited about this opportunity. It's not every day you get a chance to speak with an American legend," said I-Connect007 Publisher Steve Gold. "We are honored that he accepted our invitation."