Article Highlights
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/12/2022 | Andy Shaughnessy, I-Connect007
Today’s M&A: Right on Target
08/09/2022 | Nolan Johnson, I-Connect007
Challenges of the 2022 PCB Market: The Party’s Over
08/08/2022 | Pete Starkey, I-Connect007
IPC's I-Connect007 Acquisition Update With John Mitchell
08/05/2022 | Nolan Johnson, I-Connect007
Q4 Concerns: Hold on to Your Hats
08/03/2022 | Shawn DuBravac, IPC
PCB :: New Technology

Latest Articles

Data, Data and More Data!

What does IoT really mean and how does it affect us? Personally, I haven't felt a great need to wear an armband or have my front door lock automatically, or have my washing machine start up at some odd time. I have timers on lamps, and I use a few auto sensors for other things. Isn't that enough? Apparently, not anymore!

All About Flex: Plated Through-holes in Flexible Circuits

There is probably no more important feature than the plated through-hole (also called via or via hole) with regard to the reliability and integrity of a flexible circuit. The through-hole provides electrical connection between insulated layers and enables electrical functionality on double-sided and multilayer flexible circuits.

Cars, Cars, Cars!

The September 2015 issue of The PCB Magazine focuses on automotive electronics, and includes discussions on the automotive electronics market today, where it's heading tomorrow, and what it all means to companies wanting to participate; latest innovations in automotive electronics technologies; and what to expect in our car of the future.

Agricultural Drones and Flexible Circuits

Agricultural drones are expected to have a significant impact on farming over the next few years. In the article mentioned above, the drone’s ease of use and affordability make this a tool that virtually every farmer could employ. One major complementary technology to the drone is the advances in imaging technology and analysis. Specifically, the agricultural drone gives farmers data analysis capability that they have not had before.

Enabling Smart Wearable Technology: Flexible, Stretchable Interconnect

In this article, Joan Vrtis highlights the current and forward-looking interconnect technologies enabling the stream of amazing new smart wearable electronic devices connecting the user to their personalized experience.

Flexible and Stretchable Circuit Technologies for Space Applications

This article describes two original technologies developed at imec-CMST--the ultra-thin chip package (UTCP) and stretchable moulded interconnect (SMI)--and how they could be offering new form factors with increased functional density, as well as improved reliability in harsh environments .

Novel High-Performance Substrate for Stretchable Electronics

A cornerstone feature of any viable stretchable material is its ability to return to zero after stretching. This article talks about a new transparent, high-performance thermal setting stretchable material that could open doors to a range of new and innovative products.

HDPUG Demonstrates Benefits of Cooperative R&D

The High Density Packaging User Group (HDPUG) is a member-driven, non-profit, project-oriented industry consortium that addresses the integration of new electronics component packaging and interconnection technologies into the supply chains of its member companies.

The Flex-to-Fit Approach

The flex-to-fit concept reminds us that creativity and engineering go hand-in-hand. When there is not ample space for a conventional approach, this process, which is the convergence of the mechanical world and the electronics world, results in the ability to design a flexible circuit along the contour of an existing, irregularly shaped structure.

An Optical Update with TTM

Barry Matties recently met with Marika Immonen, manager of R&D optical interconnects at TTM Technologies. They last spoke one year ago. This time, they discussed the optical project that she’s been leading, as well as the future of optical technology in the PCB industry.


Multek CTO Excited About the Challenges of the Fast-Moving Wearables Market

I-Connect007 Publisher Barry Matties and recently-appointed Multek CTO Dr. Joan Vrtis sat down at IPC APEX EXPO to discuss the rapidly evolving wearables market, especially for medical, and the myriad questions that must be addressed. Other topics include Multek’s contribution to the wearables industry and what it sees as the main challenges to putting their circuits into various applications.

Are There Advantages to Changing Your Registration System?

I-Connect007 Publisher Barry Matties recently had a conversation with DIS's Tony Faraci at IPC APEX EXPO 2015, to learn more about their pinless registration system. What was most interesting to Barry are the potential advantages a pinless system offers and if so, why the process has not been widely adopted.

How 3D Printing Will Impact PCB Fabrication

In the near future, we will enter an era where electronic devices are printed, rather than assembled. They will be fabricated layer-by-layer as a single object, rather than assembled from separate mechanical, electrical, and optical parts. This article finds out the implications 3D printing will have on PCB manufacturing.

Mentor: PCB Technology Leadership Award Winners

Continuing its tradition of promoting and recognizing PCB design excellence, Mentor has announced the winners of its 25th annual PCB Technology Leadership Awards. Started in 1988, this program is the longest running competition of its kind in the EDA industry. It recognizes engineers and designers who use innovative methods and design tools to address today's complex PCB systems design challenges and produce industry-leading products.

Thin PCBs for Smart Phones: Technology and Reliability Considerations

The next generation of smartphones will demand very thin multilayer boards to reduce product thickness. This paper shows three different manufacturing approaches which can be used for very thin, any-layer build-ups. The technological approaches are compared on reliability level--the any-layer copper filled microvia technology which is to be considered state-of-the-art for high-end phones and the ALIVH-C/G technology well established in Japan.

Basic Principles of Polymer Thick Film Flexible Circuits

Polymer thick film circuits are similar to their rigid and flexible counterparts; however, because of the materials and processes, they have their own very specific design rules. Because most PTF processing is most commonly based on screen printing technology, the limits of design are intrinsically linked to the printed ink's processing considerations and limitations.
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