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RTW IPC APEX EXPO 2019: Atotech Discusses Developments in Metallization Chemistries

Roger Massey, technical marketing manager at Atotech, and Technical Editor Pete Starkey discuss the challenges technologists face as circuit lines and spaces get smaller and smaller, and the latest developments in metallization chemistries to help customers address these issues.

IPC APEX EXPO 2019: It's a Wrap!

The IPC APEX EXPO 2019 show floor closed yesterday with applause. After three days of meetings, networking, and tire kicking, if you will, exhibitors head back to their offices with a list of leads, to-do lists, and stories to share. Meanwhile, attendees now head home with important decisions to make about what they learned and who they want to do business with.

RTW IPC APEX EXPO 2019: Ventec Highlights Core Solutions for Thermal Management

Jack Pattie, president of Ventec International Group, speaks with I-Connect007 Guest Editor Kelly Dack about the many heat issues associated with circuit boards right now—whether in general applications, power applications, PCs—as everyone demands smaller, faster, and more powerful systems.

IPC APEX EXPO 2019 Day Two: Do You Hear That Buzz?

On the IPC APEX EXPO show floor Wednesday, the energy and action peaked with control software and interconnected machine communication continuing to be the buzz at the show.

RTW IPC APEX EXPO 2019: Updates on Taiyo’s Inkjet Solder Mask

Donald Monn, regional sales manager at Taiyo America, speaks with I-Connect007 Technical Editor Pete Starkey about the latest updates in their inkjet solder masks, and the many installations around the world that they are seeing for their product.

AltiumLive Munich: Day 2 Keynotes

Having enjoyed the conference dinner and robot battles of the previous evening, a good night’s sleep, and a hearty breakfast, Altium’s family of over 220 electronics engineers and designers eagerly returned to the conference room. Many jostled to secure the best seats for the second day of the European AltiumLive design summit in Munich, keen to make the most of the “learn, connect, and get inspired” opportunity it offered.

Laser Focus on Flex and Rigid-flex

ESI’s Chris Ryder, director of Product Management, and Shane Noel, Flex Systems product manager, discuss laser vias for flex users and the increasing necessity for companies to collaborate early on and become more and more involved, whether that be in the product design, or with the process or base material manufacturers.

Atotech at HKPCA on Announcements and Advancements

Edy Yu, managing editor for PCB007 China, caught up with Daniel Schmidt, Atotech’s director of global marketing, during the 2018 HKPCA and IPC Show in December. Edy and Daniel discussed Atotech’s new announcements at the show including their new solutions for 5G, high-speed, and high-frequency applications, and more.

Catching Up with Artnet Pro

I recently caught up with my old friend Meir Polack, co-owner with Rony Hod of Artnet Pro, which is a high-tech equipment sales and service company with offices in the U.S., China, and South America. We discussed a new line of direct imaging equipment called Altix (also the name of the company).

ESI’s Chris Ryder: There’s More to Choosing a Laser Than You Think

At the recent HKPCA show, I sat down with ESI’s Chris Ryder, director of product management—HDI—to discuss considerations for choosing a new laser system, and how ESI uses its decades of flex and rigid-flex drilling experience to help guide customers in their decision-making process.


CES Press Day: NVIDIA, Samsung, and Intel

Three major companies—NVIDIA, Samsung, and Intel—had lengthy, interesting presentations on CES press day, and each had with their own agenda.

Agfa on Revolutionary Inkjet Solder Mask Applications

Does inkjet solder mask have the potential for volume production? Mariana Van Dam, global sales manager for PCB imaging solutions, and Dr. Frank Louwet, business unit manager for advanced coatings and chemicals, discuss Agfa's latest developments, plus some novel applications for inkjet etch and plating resists.

Better to Light a Candle: Chapter One—Prepping the Next Generation

There has been a considerable amount of (electronic) ink and words shared in our industry bemoaning the graying-out of our industry and the growing shortage of skilled people at all levels. (See the May 2017 PCB007 Magazine column “Help Wanted—and How!” for just one example). As is usually the case, though, when all is said and done, more has been said than done.

Dan Feinberg: A CES 2019 Preview

Dan Feinberg gets a first look at the new devices and technologies being shown this year at the innovation world's biggest expo. Read on.

MacDermid Enthone Discusses Consolidation Benefits

At the 2018 electronica exhibition in Munich, Frando van der Pas, director of marketing and sales for MacDermid Enthone—Europe, and Technical Editor Pete Starkey discussed the consolidation benefits and the vision and future of the company.

Robert Art on the Importance of Thermal Management

Robert Art, global account manager for IMS materials at Ventec International Group, discusses future market requirements for thermal management materials, the need for a better understanding of the concept of thermal impedance, and an initiative to propose a consistent industry-standard method for measuring thermal conductivity while at electronica 2018.

Top 10 Most-Viewed FLEX007 Articles in 2018

Here’s a list of the top 10 most viewed FLEX007 articles in the past year.

Institute of Circuit Technology Harrogate Christmas Seminar 2018

The Institute of Circuit Technology returned to the fading Victorian splendour of the palatial and stately Majestic Hotel in the North Yorkshire town of Harrogate for its 2018 Christmas seminar, an intense programme of five excellent technical presentations, impeccably organised and moderated by Technical Director Bill Wilkie and generously supported by GSPK Circuits.

Top 10 Most-Read PCB007 Interviews of 2018

Here’s a list of the top 10 most-read PCB interviews in the past year. Topping the list is an interview by Publisher Barry Matties with industry veteran Gene Weiner, who talked about the market conditions in China, and any effect the new U.S. administration might have on trade relations going forward.

Chris Nuttall Discusses NCAB Group's IPO and Future Plans

Editor Nolan Johnson sat down with Chris Nuttall, COO and VP of technology at NCAB Group, to discuss software tools, predictive reports, and the company's recent IPO.


The Shape of Things to Come: Curved, Flexible, Stretchable, and Three-Dimensional Electronics

The seamless integration of electronics into flexible, curved, and even stretchable surfaces is being requested for several markets, such as automotive (dashboards, lighting, sensors), smart buildings (lighting facades, air quality, solar panels), medical (health patches, X-ray, analysis), and smart clothing (position tracking, sports).

Top 10 Most-Read PCB007 Articles of 2018

Every year, we like to take a look back at the most popular PCB news and articles. These are the top 10 most-read PCB articles from the past year. Check them out.

Automation Attracts: The New Guard to PCB Fabrication

It only took a few seconds inside the GreenSource Fabrication plant for the I-Connect007 staff to realize just how different the facility is. The look and feel of the place, however, is just one difference; staffing the facility is unique as well.

Upcoming 2019 Trade Show Season in the USA

A look back at Dan Feinberg's predictions made a year ago, and a preview of what we might see at CES 2019 along with some new projections. CES—the first, largest, and most influential and predictive of global electronics trends of this group of trade shows.

Successful Flex Circuit Design and Processing Guidelines

With the use of sensors and technology in everything from mobile phones to refrigerators, automobiles, and wearable medical devices, circuit boards are a component in many different types of products. In today’s world of electronics, any product with an on-off switch contains a circuit board.

Tarja Rapala-Virtanen Discusses Appointment as EIPC Technical Director

Tarja Rapala-Virtanen discusses her role as the newly appointed technical director of EIPC, Michael Weinhold’s retirement and impact on her career, and the draw and success of EIPC conferences.

Schmoll and Burkle: Lasers and Drills for GreenSource

While at GreenSource Fabrication, Burkle Automation Technology’s Dave Howard introduced me to the Schmoll equipment as well as other items that Burkle installed at the facility. One unit of great interest was the Impex inspection machine which can do sophisticated non-destructive cross-sections using a very fine fiber probe.

John Hendricks on 5G Materials

At the 2018 electronica exhibition in Munich, John Hendricks, product marketing manager for Rogers Corporation, discussed 5G materials including demands and trends.

Technology Ambassador Alun Morgan

Barry Matties speaks with Alun Morgan about his new position as technology ambassador for Ventec International Group. In this position, Alun will use his wealth of knowledge and experience to inform the supply chain better when it comes to topics like thermal management and the sometimes shaky connection between designers and material suppliers.

Atotech Brings World-Class AHDI to the U.S.

During our walk-through of the GreenSource Fabrication facility with VP Alex Stepinski, he started the conversation on surface preparation and plating by saying, “We have Atotech horizontal production technology in place here. We’ve been running Atotech turnkey solutions for a while.


Ventec's Marketing Strategy and Their Newly Appointed Technology Ambassador

At electronica 2018, Mark Goodwin, chief operating officer at Ventec International Group, discusses the company’s marketing strategy along with their newly appointed technology ambassador, Alun Morgan, and how he sees the world.

Meet All Flex’s New President and CEO Matt Keithly

All Flex Flexible Circuits and Heaters recently appointed Matt Keithly as their new president and CEO. In this exclusive interview, Keithly discusses his background, the direction of the company, and topics related to flexible circuits and other areas of All Flex’s business.

Innovative PCB Processes are Lean and Green

Not much has changed in printed circuit multilayer manufacturing in the last 50 years except that the equipment is more mechanized and streamlined, the processes much more stable, and high-volume PCB manufacturing has moved to China.

GreenSource: The Future

This issue is a special one. We devote the entire magazine to a detailed look at Green-Source Fabrication (a division of Whelen Engineering) and its brand new, fully automated HDI facility in New Hampshire. GreenSource is arguably the most advanced and automated fabrication facility in North America today.

150+ Years of Experience: Reflections with Three Industry Icons

You would be hard-pressed to find a more knowledgeable and experienced group than that of Gary Ferrari, Gene Weiner, and Happy Holden. In a brief interview with Barry Matties, these three industry icons consider the past, present, and future state of electronics manufacturing while also offering advice to the newest generation of manufacturers.

Strategies to Manage Your China Business Through Turbulence

While the United States may be the world’s most open market, China remains the most competitive, and is still viewed by most U.S. and EU companies as the "last great opportunity for growth.” Many companies want to gain entry to the Chinese market share for their products or services. Thus, the competition for sales of products or services is correspondingly intense. Here's how to succeed in the world's second largest economy.

Increasing Productivity for Flex Fabricators

Barry Matties and Nolan Johnson of I-Connect007 met with Shane Noel and industry veteran Mike Jennings of ESI to discuss the introduction of their CapStone laser tool, a product aimed at doubling their flex circuit fabricators’ throughput. Mike also shares advice for fabricators who are looking to move into the ever-growing flex market.

RTW SMTAI: LiloTree's Shah Discusses Hyper Corrosion, Black Pad in ENIG

Dr. Kunal Shah, chief scientist and president of LiloTree, talks about the major issues in ENIG, such as hyper corrosion—which can be very benign, or very extreme, resulting to black pad—and how LiloTree is helping to improve the performance and efficiency of the ENIG finish processes.

IPC Workforce Pledge Draws White House Praise, Points the Way to Jobs of the Future

President Trump kicked off the workforce challenge to U.S. businesses in July. As a longtime leader in education and training within the electronics industry, IPC took it as an opportunity to review our existing programs and identify ways to grow and innovate. The result? IPC joined the Pledge to America’s Workers by promising to create new career opportunities for at least 1 million Americans in the electronics industry.

Jeff Waters: Isola Updates

During PCB West 2018, Nolan Johnson and Barry Matties sat down with Jeff Waters, Isola CEO, to catch up on company activities, including the recent sale of the factory in Chandler, Arizona, the plan to build a new facility, product developments, current market dynamics, a new CFO, and much more.


Substrates for Advanced PCB Technologies: What Will the Future Hold?

The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.

Catching up with... HSIO Technologies President James Rathburn

Dan Beaulieu checked in with HSIO Technologies President James Rathburn recently to see what he and his team are up to and learned how they are using liquid crystal polymers and other materials to focus on increasing high-speed and high-density PCBs for uses in all markets.

Powering the Flexible World

From 2019 we will come to a world with flexible electronics and batteries to power these devices have attracted tremendous attention. These devices may require batteries with special mechanical properties or form factors.

IPC Signs White House Pledge to the American Worker

IPC has signed the President’s Pledge to the American Worker and made a commitment to create at least 1 million new training and workforce development opportunities in the electronics industry over the next five years.

Copper Pillar Plating Systems: High Speed, Low Heat

The industry is seeing ever-more stringent requirements of interconnect technologies (ICT) from die through final assembly, in particular digital and analog high frequencies, undistorted signal propagation and efficient heat propagation are concerned.

Flex Talk: Additive Electronics—PCB Scale to IC Scale

SAP, mSAP, SLP—what kind of crazy acronyms have we adopted now, and how much do you really need to know? In terms of consumer electronics, there is a good chance that the smartphone attached to your hand at all times contains a PCB fabricated with this technology—or at the very least, the next-generation smartphone that you purchase will utilize mSAP technology.

RTW SMTAI: MacDermid's Lenora Clark Talks Automotive Electronics Trends

Lenora Clark, director for end-user applications at MacDermid, discusses some of the trends happening in the automotive electronics industry. She talks about how her company is educating their customers in the automotive electronics sector on the available technologies in other markets such as military and aerospace, telecommunications—even the handheld market—and how they can adopt these technologies in their industry.

RTW SMTAI: John Mitchell Updates on IPC's Education Efforts

Dr. John Mitchell, president and CEO of IPC, sits down with I-Connect007 Managing Editor Nolan Johnson to discuss IPC's recent work in education and workforce engagement, as well as the latest developments in their certification program.

RTW SMTAI: NCAB Discusses Its Sustainability Programs

Doug Drayer, General Manager, Central Region, at NCAB Group, details the company's three-pronged sustainability programs and ISO 26000. He also talks about the company’s recent successful listing in the Stockholm Stock Exchange, and the importance of working with the customers especially during the design process.

Smartphone Substrate-Like PCBs Will Revolutionize the IC Substrate and PCB Markets

The smartphone is one of the high value-add products that carries a very high demand for miniaturization. Customers expect larger screens, cameras with high resolution, and various other functions, in lighter and thinner phones.


The Changing Shape of the HDI Market

With more mobile device designers looking to utilize the benefits of FOWLP and other direct attach package types, a new generation of HDI PCBs is already in the market. Targeting less than 30 mm features and based on mSAP techniques, these substrate-like PCBs make use of the latest high-end manufacturing processes and materials, to enable the next evolution in advanced HDI boards.

GP Ventures’ Tom Kastner on PCB Mergers and Acquisitions

Tom Kastner, president of GP Ventures, he has his finger on the pulse of the industry's mergers and acquisitions (M&A) more than anyone. In this interview, Kastner provides insights on the right time to buy, how to evaluate your company's worth, and when it is too late.

Defense Speak Interpreted: Defense Electronic Supply Chain Issues

On October 5, 2018, the Department of Defense (DoD) highlighted issues with the release of the 146-page report “Assessing and Strengthening the Manufacturing and Defense Industrial Base and Supply Chain Resiliency of the United States” from President Donald J. Trump.

Sunshine Global Circuits Discusses its Rapid, Targeted Growth

In an interview with I-Connect007, Jimmy Fang, VP of business development at Sunshine Global PCB Group, speaks about the key demand drivers for the PCB industry, the challenges in the market, and the opportunities they are seeing.

What's FLITE About? An Old Man's Observations

FLITE—Female Leaders in Tech, Everywhere—aims to raise the visibility of females in technology, manufacturing, and engineering by celebrating their achievements and learning from their experiences. I-Connect007 Technical Editor Pete Starkey sit in on FLITE's networking event at the recent What's New in Electronics (WNIE) Live show to find out more about this enterprise, which turned out to be an inspirational eye-opener.

SLP: The Next Level of Technology

As our electronic devices and machines become more powerful and as Moore’s Law chugs along, things in the world of PCBs keep getting smaller. You know the drill—finer lines and spaces, thinner laminates, more layers— cram more circuitry into the same or shrinking area. Where will it all end? Or will it?

Building a Better Board: It Always Comes Back to Communication

For our experts meeting on the August’s theme of reliability, we reached out to Colonial Circuits and asked them to participate in a conference call with our I-Connect007 editorial team consisting of Dan Feinberg, Andy Shaughnessy, Patty Goldman, and Happy Holden. Joining the call from Colonial Circuits was Mark Osborn, president and CEO, Kevin Knapp, quality manager, and Rodney Krick, manufacturing manager.

The IPC High-Reliability Forum for Mil-Aero and Automotive Sectors

I-Connec007’s Happy Holden had the pleasure of attending IPC’s High Reliability Forum (HRF) in Baltimore in May. As the IPC scripted it, it was a “Technical Conference with a Focus on Electronics Subjected to Harsh-Use Environments.”

From Trend to Game Changer: Which Technology Will Make the Cut?

At the recent EIPC Summer Conference, Hans Friedrichkeit of the PCB Network gave an engaging presentation on artificial intelligence and future technologies, which was well received by attendees. Who better than Hans to offer insight on which future megatrends might truly become game changers? Publisher Barry Matties sat down with Hans to get his take on trends such as 5G, autonomous cars and 3D printing.

Mechanism and Mitigation of Nickel Corrosion in ENEPIG Deposits

Nickel corrosion in ENEPIG was reproduced using exaggerated dwell time in the immersion gold bath. Nickel corrosion will occur at the manufacturing site if there is an attempt to plate thicker (>2.8 µin (0.07 µm) gold with standard immersion gold chemistry.


Ventec Keeps 'Shaking Things Up' with tec-speed 20.0

At the EIPC summer conference, I-Connect007 Publisher Barry Matties caught up with Ventec Europe & Americas COO Mark Goodwin, who provided an update on Ventec’s new products, the current state of the company, and how Ventec is shaking things up in the materials marketplace.

PCBs Are Moisture-Sensitive Devices

Research by SMT & Hybrid GmbH (now SMT Elektronik) was conducted just prior to the original publication of IPC-1601, which now provides detailed guidelines for the packaging and storage of PCBs, both from the PCB manufacturer and at the assembler’s manufacturing floor.

Reliability Takes on a New Urgency

Consumers wanted a reliable car that wouldn’t break down on the road; a computer that wouldn’t crash; a phone network that wouldn’t drop our calls; the plane we were hurtling across the sky in to stay in the air and land safely, with the wheels down. In retrospect, those seem rather simple wants, and the industry certainly wants to deliver.

Atotech on Challenges and Opportunities in PCB Manufacturing

Abel Ruivo, Atotech Deputy Business Director of Electronics for Greater China, and Daniel Schmidt, head of Global Marketing for Electronics at Atotech Group, spoke with I-Connect007 about the various challenges of PCB manufacturing in China, as well as about the opportunities in the sector.

The Sum of All Parts: Factors of Reliability

A popular definition of reliability is “The quality of being trustworthy or of performing consistently well.” Upfront engineering is of utmost importance in developing a design that will endure its intended life cycle. On the other hand, the manufacturing of that design is just as critical.

PCB Design, Fabrication and Use from the Mil-Aero End-User Perspective

The procedures described for Rolls Royce were directly comparable with those described for MBDA, and the presenters were unanimous in re-emphasising the importance of working closely with their chosen PCB fabricators at all levels and all stages of design, qualification and production of their circuit boards.

Thermal Capabilities of Solder Masks: How High Can We Go?

This article focuses on three different coating material groups that were formulated to operate under high thermal stress and are applied at the printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications.

Circuit Automation on the Ever-Evolving World of Solder Mask

In a recent conference call, I-Connect007 editorial team was joined by Circuit Automation’s Yuki Kojima, VP of engineering; Larry Lindland, sales and applications manager; and Tom Meeker, CEO, for a lively discussion about solder mask. Spoiler: It’s not all about the equipment.

Countering Solder Mask Residue Production Concerns

The solder mask application is one of the key considerations to ensure a successful application of a selective finish. The selective finish is the final chemical step of the PCB manufacturing process; this is when the panels are at their most valuable and are unfortunately not re-workable.

IMPACT on DIVSYS and NWSC Crane

I-Connect007's Patty Goldman has known DIVSYS’ Stan Bentley for many years, having met when the company was called Diversified Systems and they made circuit boards and finished products at their facility in Indianapolis. They saw each other at IMPACT recently, and of course had to have a chat.


Solder Mask: You’ve Come a Long Way, Baby!

For the July 2018 issue of PCB007 magazine, I-Connect007's editing team met with Electra Polymers’ Shaun Tibbals and Antony Earl to discuss what’s new with solder mask, including direct imaging and inkjet printing of solder mask, and what PCB manufacturers and OEMs need to know.

More Than a Word: Solder Mask

Do you spend time, as I do, musing on the language of PCBs? We have developed our own lexicon to convey as much by picture, as by word, what exactly we mean.

Calumet Electronics on IMPACT 2018

This year at IMPACT Washington, DC, I-Connect007's Patty Goldman sat down with Steve Vairo and Mike Kadlec of Calumet Electronics, to get their overview on the event.

Study on Application of Four-Wire and Four-Terminal Flying Probe Test Scheme

With the four-wire and four-terminal flying probe test method, voids in the holes formed in the PCB due to process differences, thin copper, and poor conduction due to residual adhesive after laser drilling of the HDI board can be detected, and the circuit board guide can be solved. With the development of multilayer, high-density PCB layout, four-wire four-terminal flying probe testing will play an increasingly important role.

Advanced Copper Plating Process for Any Layer Via Fill Applications with Thin Surface Copper

Copper-filled microvias are a key technology in HDI designs that have enabled increasing miniaturization and densification of printed circuit boards for the next generation of electronic products. Compared with standard PTHs, copper-filled vias provide greater design flexibility, improved signal performance, and can potentially help reduce layer count, thus reducing cost.
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