Article Highlights
The CPCA and China’s Electronic Circuit Industry: Past and Future
12/11/2019 | Wang Longji, CPCA
Pluritec Takes Industry 4.0 to the Next Level
12/11/2019 | Pete Starkey, I-Connect007
Industry Set for Shift to True 3D Printing and Photonics
12/09/2019 | Nolan Johnson, PCB007
Nolan’s Notes: Clarity of Vision
12/05/2019 | Nolan Johnson, PCB007
Calumet Electronics and Averatek Team Up on A-SAP
12/02/2019 | Nolan Johnson, PCB007

Latest Articles

Gene Weiner on the IPC APEX EXPO 2019 Automotive Executive Forum

Dan Feinberg spoke with Gene Weiner, president and CEO of Weiner International Associates, about IPC's history of forums, his thoughts on the Executive Forum on Advancing Automotive Electronics at IPC APEX EXPO 2019, and how the IPC Hall of Famers and the industry can help improve forum success.

RTW IPC APEX EXPO 2019: Pluritec Partners: Information Systems, ECOSPRAY, & OCCLEPPO

Pluritec VP of Sales Lino Sousa discusses the history of Pluritec and its relationships with Information Systems and ECOSPRAY. He also announces the purchase of the assets and identity of OCCLEPPO, and describes the long-term plan for the integrated one-stop-shop.

Inspiring the Next Generation of Industry Leaders: IPC STEM Student Outreach Program

At IPC APEX EXPO 2019, I-Connect007 Managing Editor Patty Goldman spoke with Colette Buscemi, IPC's senior director for education programs, about the success and expansion of the IPC STEM Student Outreach Program, activities and scholarship opportunities for students through sponsor support—including I-Connect007—and feedback she received on the event.

Book Recommendation: GAP Selling

Get ready for the ride of your life because this book will rock your world. It is the best book on selling that I’ve read in 10 years, and I read all of them. This book debunks all of the so-called “axioms” about selling that you have heard throughout your career. The author “Keenan” (don’t ask, I didn’t) handles all of that sticky stuff that slows down—nay, just about kills—your sales effort.

Reflections on Supply Chain Issues

There are parallels in the PCB fabrication industry right now. PCB fabrication is a lot like that VW microbus. Everything is running just fine while the supply is there. However, the materials supply pipeline is becoming increasingly unpredictable.

Trump Administration can Ease EPA Reporting Burden for Electronics Industry

The finish line may be in sight in a decade-long effort to persuade the U.S. Environmental Protection Agency (EPA) to curb unnecessary and duplicative Toxic Substances Control Act (TSCA) reporting requirements that discourage recycling of manufacturing byproducts.

Isola Executive Vice Chairman and Acting CEO Travis Kelly on the Upcoming Year

Isola Executive Vice Chairman and Acting CEO Travis Kelly discusses the recent milestones for the company, including the leadership transition. Travis also outlines his agenda for the upcoming year and gives an update on Isola’s new facility in Chandler, Arizona.

NCAB Group on Supply Chain Issues

Wayne Antal, a key account manager with NCAB Group, discusses supply chain issues, the effect he sees on PCB fabrication channels, and how his customers are adapting to the new business dynamics. This is part one of a two-part conversation with Antal.

Selective Solder Mask Deposition by Inkjet

At IPC APEX EXPO 2019, Pete Starkey spoke with Joost Valeton, product manager for PiXDRO inkjet printing equipment with Meyer Burger, about their newly configured inkjet printer for PCB applications, and bringing awareness to opportunities using selective solder mask deposition.

RTW IPC APEX EXPO 2019: Super PCB Discusses High-end PCB Procurement Services

Kelly Dack speaks with Jessica Zhang, program manager for Super PCB, who focuses on serving customers with a small-business-type relationship. Based in Plano, Texas, Super PCB matches customer design requirements to a myriad of supplier capabilities through time-saving, direct communication with the supplier and best pricing.


Thinking and Designing in Three Dimensions

This article aims to encourage interconnect designers who design for flex or rigid-flex circuits to use the modern CAD tools at their disposal for getting flex done right the first time. While modeling PCBs in 3D is not new, and all the major PCB EDA vendors offer some form of 3D modeling and integration, it is still a rare circumstance that flexible circuit designers use 3D CAD modeling.

Can E-waste and Metals Recovery Efforts Lower Environmental Risks and Liability?

Gold, palladium, silver, and other precious metals (PMs) in manufacturing wastes represent high value, but how PMs are recovered can pose environmental and liability issues. Aerospace and electronics manufacturers and suppliers, in particular, produce volumes of manufacturing wastes that contain varying levels of PMs.

RTW IPC APEX EXPO 2019: MacDermid Alpha on Affinity for ENIG

John Swanson, director of final finishes for MacDermid Alpha Electronics Solutions, speaks with I-Connect007 Guest Editor Kelly Dack about the ENIG finish process and their new product Affinity, which smooths out the challenges of the process.

Book Recommendation: The Greatest Salesman in the World

If you haven’t read this classic yet, it’s high time that you did; it’s an oldie but a goodie. Obviously, from the title, you can guess that it is a bit dated (please excuse the term “salesman”). Good, I’m glad we got that out of the way.

RTW IPC APEX EXPO 2019: CBT and Technica’s Relationship, Roadmap, and Equipment

Pete Starkey speaks with David J. Clark, CBT project director, and Najib Khan, photoimaging product manager at Technica, who explain the background of their companies and their current working relationship. Further, they address their technology roadmap, and the unique features of their direct imaging equipment—particularly the registration accuracy that can be achieved.

RTW IPC APEX EXPO: Rogers' Anthony Mattingly Discusses the Advanced Laminate Market

Rogers Corporation's Senior Product Manager Anthony Mattingly and Editor Pete Starkey discuss the ever-evolving market for advanced laminates for technologies such as 5G. Mattingly explains how Rogers has invested heavily in infrastructure for adding about 40% more capacity in the next few years.

Tara Dunn Shares Strategies for Today’s PCB Business

At the recent AltiumLive event, Barry Matties met with PCB sales expert Tara Dunn of Omni PCB to discuss selling strategies for selling PCBs in the North American market. The conversation also covers strategies for staying competitive through a generational shift in the ownership of PCB shops, and the importance of supply chain communication and building relationships.

RTW IPC APEX EXPO 2019: Meyer Burger Highlights Inkjet Solder Mask Printing Equipment

Annegret Lewak, head of sales at Meyer Burger, speaks with Steve Williams about their latest inkjet solder mask printing equipment, which offers advanced accuracy and resolution imaging.

RTW IPC APEX EXPO 2019: Uyemura Discusses Heavy Gold Deposition

Richard DePoto, business development manager at Uyemura, brings Pete Starkey up to speed with the success of the heavy gold deposition process they discussed last year. It has been seamlessly integrated into standard ENEPIG lines to give a choice of finishes, and how advances in electroless palladium have enabled the elimination of electroless nickel for high-speed signal integrity.

RTW IPC APEX EXPO 2019: The Circle Is Complete

Jesse Ziomek, sales specialist for North and South America at DIS Inc., speaks with I-Connect007 Technical Editor Pete Starkey on the growth of the company in the global market, and how DIS continues to make life easier for fabricators of rigid, flex, and rigid-flex multilayers by showing them the benefits of their pinless registration systems.


RTW IPC APEX EXPO 2019: LPKF Highlights Laser Processing Tech, Glass Drilling Capabilities

Guest Editor Joe Fjelstad sits down with Stephan H. Schmidt, LPKF president, who provides an overview of the company's laser processing machine and their capabilities, and highlights the new glass drilling capabilities.

RTW IPC APEX EXPO 2019: New IPC Technical Education Program Manager

Brook Sandy-Smith discusses her new role as IPC technical education program manager, which is also a brand-new IPC position. She further explains the benefits of membership, when a member should contact her, the IPC STEM Outreach Program, and upcoming events.

FDA Approvals: Clearing the Hurdles

Manufacturers of medical electronics have their work cut out for them. These products have to pass approval by the Food and Drug Administration (FDA) in addition to getting the nod from more typical entities such as Underwriters Laboratories (UL) and Conformité Européenne (CE, also known as European Conformity).

RTW IPC APEX EXPO 2019: Taiyo Discusses New Solder Masks and Photoimageables

Donald Monn, Midwest regional sales manager for Taiyo America, turns the tables on I-Connect007 Technical Editor Pete Starkey and quizzes him about his knowledge of Taiyo's new crack-resistant white solder mask for automotive, and the company's standard photoimageables re-formulated for laser direct imaging (LDI) that avoid the need for UL requalification.

RTW IPC APEX EXPO 2019: A Conversation with Burkle’s David Howard and Kurt Palmer

Burkle North America's David Howard has chosen to take a well-earned retirement, and introduces Pete Starkey to his worthy successor Kurt Palmer.

RTW IPC APEX EXPO 2019: Ventec's Goodwin on Global Technology Directions

Mark Goodwin, Ventec International Group CEO EMEA and USA, comments on technology directions globally and in the North American market. He also explains how Ventec's quality accreditations, technical expertise, and flexible manufacturing capacity continue to strengthen their leading position.

CES 2019: More Show Floor Favorites

In my final piece covering CES 2019, I will review more automotive technology, updates on 3D printing, and some trending devices such as smartwatches and new computer components for those that either need or just want to have extremely powerful and impressive-looking computers.

RTW IPC APEX EXPO 2019: Atotech Discusses Developments in Metallization Chemistries

Roger Massey, technical marketing manager at Atotech, and Technical Editor Pete Starkey discuss the challenges technologists face as circuit lines and spaces get smaller and smaller, and the latest developments in metallization chemistries to help customers address these issues.

IPC APEX EXPO 2019: It's a Wrap!

The IPC APEX EXPO 2019 show floor closed yesterday with applause. After three days of meetings, networking, and tire kicking, if you will, exhibitors head back to their offices with a list of leads, to-do lists, and stories to share. Meanwhile, attendees now head home with important decisions to make about what they learned and who they want to do business with.

RTW IPC APEX EXPO 2019: Ventec Highlights Core Solutions for Thermal Management

Jack Pattie, president of Ventec International Group, speaks with I-Connect007 Guest Editor Kelly Dack about the many heat issues associated with circuit boards right now—whether in general applications, power applications, PCs—as everyone demands smaller, faster, and more powerful systems.


IPC APEX EXPO 2019 Day Two: Do You Hear That Buzz?

On the IPC APEX EXPO show floor Wednesday, the energy and action peaked with control software and interconnected machine communication continuing to be the buzz at the show.

RTW IPC APEX EXPO 2019: Updates on Taiyo’s Inkjet Solder Mask

Donald Monn, regional sales manager at Taiyo America, speaks with I-Connect007 Technical Editor Pete Starkey about the latest updates in their inkjet solder masks, and the many installations around the world that they are seeing for their product.

AltiumLive Munich: Day 2 Keynotes

Having enjoyed the conference dinner and robot battles of the previous evening, a good night’s sleep, and a hearty breakfast, Altium’s family of over 220 electronics engineers and designers eagerly returned to the conference room. Many jostled to secure the best seats for the second day of the European AltiumLive design summit in Munich, keen to make the most of the “learn, connect, and get inspired” opportunity it offered.

Laser Focus on Flex and Rigid-flex

ESI’s Chris Ryder, director of Product Management, and Shane Noel, Flex Systems product manager, discuss laser vias for flex users and the increasing necessity for companies to collaborate early on and become more and more involved, whether that be in the product design, or with the process or base material manufacturers.

Atotech at HKPCA on Announcements and Advancements

Edy Yu, managing editor for PCB007 China, caught up with Daniel Schmidt, Atotech’s director of global marketing, during the 2018 HKPCA and IPC Show in December. Edy and Daniel discussed Atotech’s new announcements at the show including their new solutions for 5G, high-speed, and high-frequency applications, and more.

Catching Up with Artnet Pro

I recently caught up with my old friend Meir Polack, co-owner with Rony Hod of Artnet Pro, which is a high-tech equipment sales and service company with offices in the U.S., China, and South America. We discussed a new line of direct imaging equipment called Altix (also the name of the company).

ESI’s Chris Ryder: There’s More to Choosing a Laser Than You Think

At the recent HKPCA show, I sat down with ESI’s Chris Ryder, director of product management—HDI—to discuss considerations for choosing a new laser system, and how ESI uses its decades of flex and rigid-flex drilling experience to help guide customers in their decision-making process.

CES Press Day: NVIDIA, Samsung, and Intel

Three major companies—NVIDIA, Samsung, and Intel—had lengthy, interesting presentations on CES press day, and each had with their own agenda.

Agfa on Revolutionary Inkjet Solder Mask Applications

Does inkjet solder mask have the potential for volume production? Mariana Van Dam, global sales manager for PCB imaging solutions, and Dr. Frank Louwet, business unit manager for advanced coatings and chemicals, discuss Agfa's latest developments, plus some novel applications for inkjet etch and plating resists.

Better to Light a Candle: Chapter One—Prepping the Next Generation

There has been a considerable amount of (electronic) ink and words shared in our industry bemoaning the graying-out of our industry and the growing shortage of skilled people at all levels. (See the May 2017 PCB007 Magazine column “Help Wanted—and How!” for just one example). As is usually the case, though, when all is said and done, more has been said than done.


Dan Feinberg: A CES 2019 Preview

Dan Feinberg gets a first look at the new devices and technologies being shown this year at the innovation world's biggest expo. Read on.

MacDermid Enthone Discusses Consolidation Benefits

At the 2018 electronica exhibition in Munich, Frando van der Pas, director of marketing and sales for MacDermid Enthone—Europe, and Technical Editor Pete Starkey discussed the consolidation benefits and the vision and future of the company.

Robert Art on the Importance of Thermal Management

Robert Art, global account manager for IMS materials at Ventec International Group, discusses future market requirements for thermal management materials, the need for a better understanding of the concept of thermal impedance, and an initiative to propose a consistent industry-standard method for measuring thermal conductivity while at electronica 2018.

Top 10 Most-Viewed FLEX007 Articles in 2018

Here’s a list of the top 10 most viewed FLEX007 articles in the past year.

Institute of Circuit Technology Harrogate Christmas Seminar 2018

The Institute of Circuit Technology returned to the fading Victorian splendour of the palatial and stately Majestic Hotel in the North Yorkshire town of Harrogate for its 2018 Christmas seminar, an intense programme of five excellent technical presentations, impeccably organised and moderated by Technical Director Bill Wilkie and generously supported by GSPK Circuits.

Top 10 Most-Read PCB007 Interviews of 2018

Here’s a list of the top 10 most-read PCB interviews in the past year. Topping the list is an interview by Publisher Barry Matties with industry veteran Gene Weiner, who talked about the market conditions in China, and any effect the new U.S. administration might have on trade relations going forward.

Chris Nuttall Discusses NCAB Group's IPO and Future Plans

Editor Nolan Johnson sat down with Chris Nuttall, COO and VP of technology at NCAB Group, to discuss software tools, predictive reports, and the company's recent IPO.

The Shape of Things to Come: Curved, Flexible, Stretchable, and Three-Dimensional Electronics

The seamless integration of electronics into flexible, curved, and even stretchable surfaces is being requested for several markets, such as automotive (dashboards, lighting, sensors), smart buildings (lighting facades, air quality, solar panels), medical (health patches, X-ray, analysis), and smart clothing (position tracking, sports).

Top 10 Most-Read PCB007 Articles of 2018

Every year, we like to take a look back at the most popular PCB news and articles. These are the top 10 most-read PCB articles from the past year. Check them out.

Automation Attracts: The New Guard to PCB Fabrication

It only took a few seconds inside the GreenSource Fabrication plant for the I-Connect007 staff to realize just how different the facility is. The look and feel of the place, however, is just one difference; staffing the facility is unique as well.


Upcoming 2019 Trade Show Season in the USA

A look back at Dan Feinberg's predictions made a year ago, and a preview of what we might see at CES 2019 along with some new projections. CES—the first, largest, and most influential and predictive of global electronics trends of this group of trade shows.

Successful Flex Circuit Design and Processing Guidelines

With the use of sensors and technology in everything from mobile phones to refrigerators, automobiles, and wearable medical devices, circuit boards are a component in many different types of products. In today’s world of electronics, any product with an on-off switch contains a circuit board.

Tarja Rapala-Virtanen Discusses Appointment as EIPC Technical Director

Tarja Rapala-Virtanen discusses her role as the newly appointed technical director of EIPC, Michael Weinhold’s retirement and impact on her career, and the draw and success of EIPC conferences.

Schmoll and Burkle: Lasers and Drills for GreenSource

While at GreenSource Fabrication, Burkle Automation Technology’s Dave Howard introduced me to the Schmoll equipment as well as other items that Burkle installed at the facility. One unit of great interest was the Impex inspection machine which can do sophisticated non-destructive cross-sections using a very fine fiber probe.

John Hendricks on 5G Materials

At the 2018 electronica exhibition in Munich, John Hendricks, product marketing manager for Rogers Corporation, discussed 5G materials including demands and trends.

Technology Ambassador Alun Morgan

Barry Matties speaks with Alun Morgan about his new position as technology ambassador for Ventec International Group. In this position, Alun will use his wealth of knowledge and experience to inform the supply chain better when it comes to topics like thermal management and the sometimes shaky connection between designers and material suppliers.

Atotech Brings World-Class AHDI to the U.S.

During our walk-through of the GreenSource Fabrication facility with VP Alex Stepinski, he started the conversation on surface preparation and plating by saying, “We have Atotech horizontal production technology in place here. We’ve been running Atotech turnkey solutions for a while.

Ventec's Marketing Strategy and Their Newly Appointed Technology Ambassador

At electronica 2018, Mark Goodwin, chief operating officer at Ventec International Group, discusses the company’s marketing strategy along with their newly appointed technology ambassador, Alun Morgan, and how he sees the world.

Meet All Flex’s New President and CEO Matt Keithly

All Flex Flexible Circuits and Heaters recently appointed Matt Keithly as their new president and CEO. In this exclusive interview, Keithly discusses his background, the direction of the company, and topics related to flexible circuits and other areas of All Flex’s business.

Innovative PCB Processes are Lean and Green

Not much has changed in printed circuit multilayer manufacturing in the last 50 years except that the equipment is more mechanized and streamlined, the processes much more stable, and high-volume PCB manufacturing has moved to China.


GreenSource: The Future

This issue is a special one. We devote the entire magazine to a detailed look at Green-Source Fabrication (a division of Whelen Engineering) and its brand new, fully automated HDI facility in New Hampshire. GreenSource is arguably the most advanced and automated fabrication facility in North America today.

150+ Years of Experience: Reflections with Three Industry Icons

You would be hard-pressed to find a more knowledgeable and experienced group than that of Gary Ferrari, Gene Weiner, and Happy Holden. In a brief interview with Barry Matties, these three industry icons consider the past, present, and future state of electronics manufacturing while also offering advice to the newest generation of manufacturers.

Strategies to Manage Your China Business Through Turbulence

While the United States may be the world’s most open market, China remains the most competitive, and is still viewed by most U.S. and EU companies as the "last great opportunity for growth.” Many companies want to gain entry to the Chinese market share for their products or services. Thus, the competition for sales of products or services is correspondingly intense. Here's how to succeed in the world's second largest economy.

Increasing Productivity for Flex Fabricators

Barry Matties and Nolan Johnson of I-Connect007 met with Shane Noel and industry veteran Mike Jennings of ESI to discuss the introduction of their CapStone laser tool, a product aimed at doubling their flex circuit fabricators’ throughput. Mike also shares advice for fabricators who are looking to move into the ever-growing flex market.

RTW SMTAI: LiloTree's Shah Discusses Hyper Corrosion, Black Pad in ENIG

Dr. Kunal Shah, chief scientist and president of LiloTree, talks about the major issues in ENIG, such as hyper corrosion—which can be very benign, or very extreme, resulting to black pad—and how LiloTree is helping to improve the performance and efficiency of the ENIG finish processes.

IPC Workforce Pledge Draws White House Praise, Points the Way to Jobs of the Future

President Trump kicked off the workforce challenge to U.S. businesses in July. As a longtime leader in education and training within the electronics industry, IPC took it as an opportunity to review our existing programs and identify ways to grow and innovate. The result? IPC joined the Pledge to America’s Workers by promising to create new career opportunities for at least 1 million Americans in the electronics industry.

Jeff Waters: Isola Updates

During PCB West 2018, Nolan Johnson and Barry Matties sat down with Jeff Waters, Isola CEO, to catch up on company activities, including the recent sale of the factory in Chandler, Arizona, the plan to build a new facility, product developments, current market dynamics, a new CFO, and much more.

Substrates for Advanced PCB Technologies: What Will the Future Hold?

The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.

Catching up with... HSIO Technologies President James Rathburn

Dan Beaulieu checked in with HSIO Technologies President James Rathburn recently to see what he and his team are up to and learned how they are using liquid crystal polymers and other materials to focus on increasing high-speed and high-density PCBs for uses in all markets.

Powering the Flexible World

From 2019 we will come to a world with flexible electronics and batteries to power these devices have attracted tremendous attention. These devices may require batteries with special mechanical properties or form factors.


IPC Signs White House Pledge to the American Worker

IPC has signed the President’s Pledge to the American Worker and made a commitment to create at least 1 million new training and workforce development opportunities in the electronics industry over the next five years.

Copper Pillar Plating Systems: High Speed, Low Heat

The industry is seeing ever-more stringent requirements of interconnect technologies (ICT) from die through final assembly, in particular digital and analog high frequencies, undistorted signal propagation and efficient heat propagation are concerned.

Flex Talk: Additive Electronics—PCB Scale to IC Scale

SAP, mSAP, SLP—what kind of crazy acronyms have we adopted now, and how much do you really need to know? In terms of consumer electronics, there is a good chance that the smartphone attached to your hand at all times contains a PCB fabricated with this technology—or at the very least, the next-generation smartphone that you purchase will utilize mSAP technology.

RTW SMTAI: MacDermid's Lenora Clark Talks Automotive Electronics Trends

Lenora Clark, director for end-user applications at MacDermid, discusses some of the trends happening in the automotive electronics industry. She talks about how her company is educating their customers in the automotive electronics sector on the available technologies in other markets such as military and aerospace, telecommunications—even the handheld market—and how they can adopt these technologies in their industry.

RTW SMTAI: John Mitchell Updates on IPC's Education Efforts

Dr. John Mitchell, president and CEO of IPC, sits down with I-Connect007 Managing Editor Nolan Johnson to discuss IPC's recent work in education and workforce engagement, as well as the latest developments in their certification program.
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