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Book Excerpt: ‘Thermal Management: A Fabricator's Perspective,' Chapter 3
01/26/2021 | Anaya Vardya, American Standard Circuits
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
01/22/2021 | Nolan Johnson, I-Connect007
Your Greatest Competition is Yourself
01/20/2021 | Barry Matties, I-Connect007
What’s Driving Price Increases for CCL and Prepreg?
01/20/2021 | Mark Goodwin, Ventec International Group
MivaTek’s New Technology and Market Drivers
01/19/2021 | Nolan Johnson, PCB007 Magazine
PCB :: Associations
IMPACT Washington 2017 Just Around the Corner
IPC's Government Relations team has worked around-the-clock to ensure that IMPACT Washington D.C. 2017 is the best yet. During this two-and-a-half day event, executives from IPC-member companies will have the opportunity to speak with leaders in Congress and the Administration in support of our common priorities.
Capitol Connection: IMPACT Update—To CEOs on Why You Should Attend IMPACT Washington, D.C. 2017
Here at IPC, we place a high priority on making our presence known in the halls of government, because so many policy debates have a direct effect on the electronics manufacturing industry. IMPACT Washington, D.C. 2017 is a chance to join with fellow industry executives in advocating for better public policies for a stronger, more advanced manufacturing economy.
Mutracx Makes Green Operations Economically Viable
During IPC APEX EXPO, I sat down for an interview with with Jeroen de Groot, CEO of Mutracx. He detailed the company’s plans to install new equipment at a facility in Romania, and he explains why having a green manufacturing operation is not enough—it must also be economically feasible.
RTW IPC APEX EXPO: Sanjay Huprikar Lays Out Plans to Grow IPC Membership
Sanjay Huprikar, IPCs vice president of member success, discusses IPCs plans to expand membership around the world.
RTW IPC APEX: HDPUG's Jack Fisher Discusses Updates on Optoelectronics Project
The HDPUG Optoelectronics project set out to demonstrate that optical waveguides incorporated within a backplane could benefit the system's interconnect topology. HDPUG facilitator Jack Fisher explains that a demonstrator has now been built and is currently under test at a number of leading OEMs.
A Conversation with Gene Weiner
In a discussion following the PCB Executive Forum at IPC APEX EXPO in February, Gene Weiner opened up to Barry Matties and Patty Goldman on the state of the North American electronics industry supply chain and the importance of cooperative efforts up and down that supply chain.
Capitol Connection: Drumroll, Please…Announcing the IPC Government IMPACT Awardees
Government relations are essential to our industry as many of the policy debates taking place will have long-lasting impact on our industry. Tax and regulations reform, immigration, and environmental regulations are up for debate and it is time for our industry to take a seat at the table.
Mike Carano on the First PCB Executive Forum Held at IPC APEX EXPO 2017
When John Mitchell came on board as president of IPC, he decided to tap the members of the Raymond E. Pritchard Hall of Fame for suggestions and advice. So he established the IPC Ambassador Council and tasked them to create special programs for IPC conferences. It is this group of people who put together the recent PCB Executive Forum that was presented at IPC APEX EXPO 2017.
Ray Pritchard Looks Back at IPC’s Beginning and His Role in Getting it Started
I have known Ray Pritchard for a long time—as long as I’ve been involved with IPC, in fact. He directed the organization for 35 years before turning over the reins. One could say he grew up with the organization—or vice versa. Ray was always a bundle of energy and still is, still joking and warm, a great people person, and I am sure he had a little something to do with the spirit of camaraderie and cooperation that is the hallmark of the IPC we know today.
RTW IPC APEX EXPO: ELCINA Inducted as a Member of WECC
WECC, the World Electronics Circuits Council, brings together industry trade associations worldwide to address issues of global importance. Secretary General Rex Rozario introduces Paresh Vasani, Honorary Secretary of ELCINA, the electronics industry association representing 300 companies in India, newly inducted as a member of WECC, and they discuss the significance of the relationship in the light of rapidly accelerating growth of electronics manufacturing in India.
Capitol Connection: Direct Legislative Action—IMPACT Washington, D.C. 2017
This ties in to why IPC–Association Connecting Electronics Industries invests so much into our government relations efforts. We place a high priority on government relations because so many public policy debates have large impacts on our industry. Our members continue to value our advocacy efforts on issues such as taxes, regulations, immigration and the environment.
A New Power Design Methodology for PCB Designs
Advanced PCB design is an iterative process of analysis-fix-analysis. Historically, this process is very time-consuming, requiring analysis experts and PCB designers to work together to find and fix layout problems. This article describes a new PCB design methodology that allows a PCB designer to perform the power design without having to run expert-level analysis tools. This methodology provides the setup automation for advanced analysis without the need to understand every minute parameter, and can be completed in a few steps.
RTW IPC APEX EXPO: IPC Validation Services Update
Randy Cherry, IPC's Director of Validations Services speaks with Guest Editor Judy Warner. Randy gives an update on the QML and QPL programs, including updates on the newest QPL program for copper clad laminates. They also discuss the growing value of industry engagement with VS as the number of certified facilities increases.
The Power of Three: A Solder Mask Solution for North America
Technology and process developments in mature industries like the printed wiring board industry are not always easy. Many new products are evolutionary enhancements of existing processes. Often, these developments enhance the process and improve overall process control.
Rogers' John Ranieri Discusses 92ML Conductive Epoxy Materials for Power Electronics
John Ranieri, Business Development Manager for Rogers Corporation, sat down for an interview with me at IPC APEX EXPO in San Diego. He discussed Rogers’ 92ML™ series of thermally conductive epoxy materials, and some of the challenges facing technologists in the power electronics market.
Schmoll Talks Technology
Schmoll’s Thomas Kunz and I had a chat recently at the HKPCA show. In our short discussion, we covered several topics, including Schmoll’s approach to the U.S. market, their work in direct imaging, and the nature of their relationship with ink suppliers.
Weiner’s World—February 2017
IPC APEX EXPO 2017 was the best in five or more years. The 60th annual meeting drew a crowd. The meetings were good. The mood was upbeat. There were reports of new orders from Asia as well as the Americas, and news of increasing business from the show floor. IPC membership was up in all its regions to more than 4,000.
Exciting New Technology: Thermal Risk Management
Two years ago I entered into a collaboration with Dr. Johannes Adam, from Leimen Germany. Johannes has written a software simulation tool called Thermal Risk Management (TRM). We used it to look at the thermal characteristics of PCB traces under a variety of conditions, and it is hard for me to contain my excitement and enthusiasm for what it does and what we learned about traces using it. Our collaboration resulted in the publication of numerous articles and a book. In this article, I’ll talk about some of the capabilities of TRM that really caught my attention.
CPCA Moves into New Venue for 2017 Show
I-Connect007 China Editor Edy Yu recently interviewed Jin Zhang, CPCA Secretary General, via e-mail. They discussed the upcoming CPCA Show, scheduled for March 7-9, and some recent changes, including the move to a new venue for this year’s annual event.
RTW IPC APEX EXPO: APEX EXPO Wrap-up Roundtable
Publisher Barry Matties and Managing Editor Andy Shaughnessy join Bob Neves of Microtek Labs for a review of IPC APEX EXPO 2017 and a look at the state of the PCB industry.
Time-Lapse Video: The IPC APEX EXPO 2017 Show in Under Seven Minutes!
During IPC APEX EXPO 2017, we at I-Connect007 had our time-lapse camera running from setup to closing. The camera was positioned high in our studio, where we conducted our RealTimewith…IPC APEX EXPO video interviews, aimed down the main aisle.
Patty's Perspective: New Technology Heading our Way— Faster than Ever!
As an excellent introduction to this issue, IPC’s John Mitchell gives us a wonderful overview of what emerging technology is and what we need to do to keep up. One thing he emphasizes is a trained and competitive workforce. Indeed, in our recent hiring survey we learned that an overwhelming percentage of you are concerned about a shortage of skilled and qualified people. John’s column is a great call to action.
Real Time with...IPC: IPC Market Research Update
Sharon Starr updated everyone on the Market Research services, industry forecasting and research projects her group publishes. She also mentioned a "call to action" for a meeting tomorrow with IPC members, seeking input on needed metrics for their new Pulse of the Industry program she will be rolling out this year, which will be a "Industry Health Scorecard".
Real Time with...IPC 2017 Videos Now Available for Viewing
Over 70 video interviews from the IPC APEX EXPO 2017 show in San Diego, CA are now available for viewing. See the opening ceremony, hear from suppliers and others on their new products, learn more about the HDP Users Group. Don't miss the videos by IPC President John Mitchell and his staff.
EIPC 2017 Winter Conference Review of Day 2
Almost everyone made it back to the conference room for the start of the second day of the EIPC Winter Conference in Salzburg, even those who had enjoyed the late networking session into the early hours!
EIPC 2017 Winter Conference Review of Day 1
Themed to address the question: “The Future Needs of the Global Electronics Industry: What Solutions will Europe Provide?" the conference was a truly international event, attracting delegates from thirteen countries, to hear a well-chosen programme of twenty presentations in five sessions, introduced by EIPC Chairman Alun Morgan.
Now is the Time for Comprehensive Tax Reform
Tax policy is among the most basic tools of any government to accomplish its objectives. From the private sector perspective, taxes are one of largest expenses of any business. But despite being such an important topic for government and business, there is widespread agreement that the U.S. federal tax code is a mess.
CES 2017: Disruptive Technologies
Those of you that have read my previous columns covering CES 2017 know that at recent CES shows I have seen many drones, autonomous cars, IoT devices, robots, and many other items ranging from robots who stand in for your doctor to smart trash cans who tell you via Alexa, Google, or soon, Cortana on your own computer, that since you have thrown away two empty milk cartons in the last few days it may be time to order more milk; just say yes and consider it ordered.
On Location at HKPCA: IPC’s Mitchell and Carmichael on Asia, the Global Industry Outlook, and Trump
While in Shenzhen, China recently, with the PCB industry’s biggest trade show as a backdrop, Publisher Barry Matties sat down once again to interview IPC President John Mitchell and IPC Asia President Phil Carmichael. This time they discussed trends they’re seeing in the Asia-Pacific region and what a Trump presidency means to the industry.
Catching up with…Dr. Anthony Caputo
I met Dr. Anthony Caputo last year while helping one of my clients secure some strong engineering talent. Anthony had been reading my columns and reached out to me since he was looking for a new opportunity in a high-tech printed circuit board facility. Once I read his CV and saw his credentials, I jumped at that chance to help this talented young man.
TTM President Thomas Edman on the Global PCB Market, Technology, and More
The TTM and Viasystems merger put the PCB industry on notice last year when it created one of the biggest powerhouses in the world. At this year’s HKPCA and IPC show, Barry Matties met with TTM Technologies President and Chief Executive Officer, Thomas Edman to get his views on the market, technology, the culture of TTM and even the Trump effect.
Patty’s Perspective: Everything You Want to Know about Vias but Were Afraid to Ask
Regarding our survey on vias, almost 85% of our respondents said they used blind/buried vias. And since 15% of those answering were either suppliers or consultants, it seems that approximately 100% use the B/Bs. OK then, on to a tougher question. We then asked how often, and it turns out that “use” covers everything from rarely to pretty much all the time, with a definite undercurrent of “because we have to.”
Real Time with...HKPCA & IPC Show 2016 Slideshow - Day 2
The 2016 IPC Hand Soldering World Championship was held concurrently for the first time at the International Printed Circuit & APEX South China Fair (HKPCA and IPC Show 2016) in Shenzhen, China. View the slideshow here.
Real Time with...HKPCA & IPC Show 2016 Slideshow - Day 1
The International Printed Circuit & APEX South China Fair 2016, presented by HKPCA and IPC, kicked off this week in Shenzhen, China. The theme of this year’s event is “Global Wisdom Shaping the Future.”
Aismalibar on Markets, Materials, and the Increase in Copper Prices
As a European laminate provider specializing in insulated metal substrates and thermal management, Aismalibar is often put in the demanding position of catering to some of Europe’s toughest customers, including the automotive industry. Pete Starkey and Barry Matties caught up with Director General Eduardo Benmayor at the most recent Electronica trade show to learn more about the company and get his take on the current state of the IMS marketplace.
Mr. Laminate Tells All: The Certification of IPC-4101D Polyimide Base Materials: Buyer Beware
At the most recent IPC meeting held in Rosemont, Illinois, one of the hot topics of discussion at the Laminate and Prepreg Subcommittee was the three polyimide specification sheets. The header portion for the three polyimide-based copper-clad laminates and prepregs are shown in Figure 1, for easy comparison of polyimide grades.
HKPCA’s Daniel Chan on China’s PCB Manufacturing and Technology Landscape
Editor Edy Yu recently spoke with Daniel Chan, executive director of the Hong Kong Printed Circuit Association (HKPCA). Chan possesses more than 25 years of experience in global business management with strong leadership influencing suppliers and internal clients in business strategy and transformation.
Streamline Circuits: The Importance of Being a Sales-Driven Organization
I recently had the pleasure of catching up with Tom Doslak, senior VP of sales and marketing for Streamline Circuits. We discussed how the company got started, technologies that seem to be driving the marketplace, critical equipment for today’s PCB fabricator, and how being a customer-centered, sales-driven organization serves as the key to their success.
Catching Up (Literally) with Uyemura’s George Milad at SMTAI 2016
I managed to catch up with George Milad of Uyemura at the recent SMTA International conference, which wasn’t easy to do. But he did take a few minutes to fill me in on his schedule for the week and it sure was packed—with a tutorial, presentations and IPC committee meetings.
IPC’s President on IPC EDGE: Cutting Edge and Education
Chatting with IPC President John Mitchell is always a good time—he never fails to be upbeat and full of ideas, and his eagerness to fill us in on what’s happening with IPC was evident during our recent interview at the IPC Fall Committee Meetings, co-located with SMTAI in late September.
TTM SJ Hosts IPC Designers Council Meeting
The Silicon Valley Chapter of the IPC Designers Council was treated to a delicious barbecue lunch on October 13 at TTM’s San Jose facility. About 20 PCB designers and support professionals gathered for the tri-tip lunch-n-learn conference.
One World, One Industry: Six Leadership Lessons from 20 Years in the Electronics Industry
The orchestra conductor is an apt metaphor for the successful leader. Effective leadership often boils down to the ability to inspire others (the symphony) to their best work, while keeping and driving the overall vision of the organization (the musical score).
All About Flex: Specifying a Flexible Circuit
IPC has created a specification document, IPC 6013, which is referenced for many flex circuit applications. This commercial document, in combination with the CAD data and print, is used as the product specification. Most flexible circuitry fabricators’ internal quality standards are based on IPC 6013.
New Developments at MacDermid Enthone
One of the best parts of industry conferences and shows is the opportunity to meet new people and renew acquaintances. Another highly enjoyable part is learning what is going on within companies—especially those with which one has had a close association in the past.
Mentor Graphics’ PADS Platform Bridges Design and Manufacturing
At PCB West, Barry Matties spoke with Paul Musto about Mentor’s PADS environment and their introduction of scalable software tools to help design better boards, from the enterprise level down to the entry level and hobbyists. They also discussed the evolution of the design process infrastructure in North America vs. Asia, and what design engineers should focus on to increase their value.
This year’s TPCA (Taiwan Printed Circuits Association) show held October 26–28 seemed to have lighter attendance than last year. Robots were on display everywhere, with lot of loaders and unloaders as well as the multi-axis, multipurpose types.
Patty’s Perspective: Take Me to Your Leader
We must have touched a real hot button when we decided to do this issue on leadership. When we sent out our survey on the topic, we received a lot of responses, which we’ll review in a separate article, plus many of our regular columnists were inspired to write on the subject.
Let's Talk Testing: Don’t Reinvent the Wheel—Find an Expert!
Back in the day when I was an engineer fresh out of college, I quickly learned that experience is the solution to many problems. Now that being said, experience comes in many forms…it could be knowledge learned from a textbook, it could be an observatory comment jotted down in a notebook, it could be a conversation with a co-worker or colleague, or it could be an Internet search that finds a scholarly technical article, etc.
One World, One Industry: Voting—A Civic Duty and Industry Opportunity
On Tuesday, November 8, more than 240 million people in the United States will have the opportunity to go to the polls and vote, make their voices heard in government, and influence the direction of public policy for years to come. Much of the world is closely watching with interest in this major U.S. election.
2016 Election Forecast
Throughout this election cycle, candidates have offered many promises to boost the U.S. and global economy, as well as address other national priorities. As we inch closer to the finish line, it’s worth examining how the presidential and several congressional races could shape the future of policies affecting the manufacturing industry.
Happy's Essential Skills: Metrics and Dimensional Analysis
After 20 of my columns, readers probably realize that I am an analytical person. Thus, I dedicate this column to metrics—the method of measuring something. I mentioned the four levels of metrics in my June column "Producibility and Other Figures of Merit." I also introduced the five stages of metrics in the second part of the column "Design for Manufacturing and Assembly, Part 2." This column completes the discussion with a look at dimensionless quantities.
This month, I was a guest at the High Density Packaging Users Group (HDPUG) meeting in Nashville, Tennessee. The consortium, composed of more than 50 companies (small and large) in the electronics packaging supply chain, conducts projects to solve real world problems or develop data for product parameters, package/component life, and production processing.
EIPC Reliability Workshop, Tamworth, UK, September 22, 2016
EIPC’s reliability workshop, presented in cooperation with Amphenol Invotec, attracted a capacity audience from eight countries—some delegates having travelled from as far away as Russia—to take the opportunity to learn first-hand how to meet OEM, ODM and EMS product quality and safety requirements, and to understand how interconnection stress testing techniques could be applied to determine the reliability of multilayer PCBs.
Happy’s Essential Skills: Recruiting and Interviewing
Hopefully, your career has progressed to the point that you are empowered to recruit your own team or a key person for your team. There are always technical people looking for better jobs, but many times, the most talented are busy doing their work and not looking for a new opportunity.
Happy’s Essential Skills: Computer-Aided Manufacturing, Part 2 - Automation Examples
Semiconductor fabs like to avoid writing custom software to fit all of the idiosyncrasies of individual processing systems. So HP developed PC-10 to handle IC process equipment by separating it into general classes. SECS II was a mandatory prerequisite of the equipment before an interface to PC-10 could be developed.
Happy’s Essential Skills: Computer-Aided-Manufacturing, Part 1—Automation Protocols
I have addressed automation planning previously in this series, so I hope by now you realize the difference between ‘automation’ and ‘mechanization.’ In printed circuit fabrication and assembly, most of what is advertised is mechanization. But when you get to assembly test, then you begin to see true automated solutions.
Happy’s Essential Skills: CIM and Automation Planning, Part 2—Six Principles of Automation
In Part 1 of this column, I discussed the foundation of CIM and the principles of automation planning. In Part 2, we will assume that all the necessary preparations in strategy and tactics have been completed. How does it all fit together for successful implementation? This problem affects large, wealthy companies as well as the smallest job shop.
Happy’s Essential Skills: CIM and Automation Planning, Part 1
There is a lot of talk and information about automation, but I find that there is very little available on automation planning. This is one of my specialties. I started by getting a master's in EE in control theory. This went well with my B.S. in chemical engineering as I specialized in process control and IC manufacturing.
If you have paid any attention at all to our newsletters and other publications, you should have been aware of this month’s topic long before opening this magazine. We tried to reach… everybody, so we could get their thoughts on the industry for this issue.
This month's column has a higher percentage of IC coverage than normal for several reasons. The end of Moore's Law regarding transistor scaling will be dead by 2021 as will be replaced by 3D integration according to the International Technology Roadmap for Semiconductors (ITRS).
High-Throw Electroless Copper– New Opportunities for IC Substrates and HDI Manufacturing
The one constant in electronics manufacturing is change. Moore’s Law, which successfully predicted a rate of change at which transistor counts doubled on integrated circuits (ICs) at lower cost for decades, is ceding to be an appropriate prediction tool.
Viking Test Services: Much More than Test
Recently, 007 Technical Editor Pete Starkey and I toured Viking Test’s facility in Hants, UK where we met Managing Director Jake Kelly to learn about the history of the company, their recent involvement in the Indian PCB market, and what he thought of the EIPC Summer Conference.
The 21st Century PCB Factory– Designed to Eliminate Offshore Cost Advantages
Over 15 years have passed since North America and Europe ceased being the center of worldwide PCB fabrication and were supplanted by a Chinese market with low-cost labor, lax environmental requirements, and strong government support. In just a few short years, the superior offshore cost advantages of this new dynamic put volume PCB production in the West out of business, aside from the military and specialty technology applications contained in the few shops that continue to exist today.
EIPC Summer Conference 2016, Day 2: Strategies to Maintain Profitability in the European PCB Industry
Delegates awoke to a gloomy Scottish morning on the second day of the EIPC Summer Conference 2016. One or two who maybe overindulged in the whisky on the previous evening had some difficulty in finding time for breakfast before the conference proceedings, but the atmosphere in the meeting room was brighter than the weather outside, as Professor Martin Goosey introduced the day’s programme.
RTW IPC APEX EXPO: Bob Neves Talks Trends Driving Test Services in China
Bob Neves, chairman and CTO of Microtek Laboratories China, talks with I-Connect007 guest editor Dick Crowe about a variety of issues, including the growing automotive electronics and military/aerospace industries, and how companies in the US that are buying boards and assemblers buying their materials in China can benefit from his company's test services locally.
IPC President John Mitchell Discusses IPC's Footprint in China
At the Capital Club in Beijing, IPC’s president John Mitchell met with I-Connect007’s Edy Yu to discuss the current activites of IPC China. Some of the topics covered included the growing China membership, training, trade shows and IPC China’s standards development effort.
Alun Morgan on the EIPC Summer Conference 2016
Each year, the EIPC puts on two conferences for their members. I recently attended their summer conference in Edinburgh and had a chance to speak with EIPC President Alun Morgan about the topics covered at the conference and the connectedness and networking that is always present at EIPC events.
EIPC Summer Conference 2016, Day 1: Strategies to Maintain Profitability in the European PCB Industry
Resplendent in the kilt, EIPC chairman Alun Morgan welcomed a large and enthusiastic gathering of printed circuit professionals from all over Europe and as far afield as the USA, Canada and Russia, to the EIPC Summer Conference 2016 in Edinburgh, Scotland's cosmopolitan capital city.
The Right Approach: Our IoT Lives
In March, at the 2016 IPC APEX EXPO show in Las Vegas, the next big thing everyone was talking about was the Internet of Things (IoT). Equipment manufacturers were standing in line to tout their machines as IoT-capable and just waiting for the industry to catch up. But the IoT has been at play in our personal lives for quite a while…
Ventec's Commitment to FOD Elimination Sets the Trend
The European Space agency has led the drive for ultra-clean laminates and pre-pregs, completely free from foreign object debris. Ventec were one of the first to respond to ESA’s call for the laminate industry to support Appendix A to IPC-4101D, which the committee has agreed will be adopted. Mark Goodwin fills in the background.
Impacting the Industry—Literally
Unless you have been living under a rock or in a cave for the past six months or so, you should be aware (and perhaps astounded, astonished, amazed, dumbfounded, aghast…) at the presidential campaign goings-on. Dear heaven! But without going into detail or expressing an opinion, I thought I would share some highlights of my recent visit to our nation’s capital.
Global Technology Development: HDP User Group European Meeting 2016
Delighted and honoured to be invited again to attend the open session of the High Density Packaging User Group (HDPUG) European Meeting, I made my way to the picturesque Grand Duchy of Luxembourg, a tiny principality bordered by Belgium, France and Germany, and ranked among the world's top-three nations in both wealth and wine consumption, to learn about the latest in collaborative research and development by member companies engaged in the manufacture of products utilising high-density electronic packages.
Gen Consulting Company (GCC) has issued the Radiant Insights report “Global HDI Printed Circuit Board Market Forecast and Analysis 2016-2021.” The report provides a detailed analysis of worldwide markets for HDI printed circuit boards from 2011–2016, and provides market forecasts for 2016–2021 by region/country and subsectors.
What’s in a Name? ICAPE Group’s Glenn Colescott Explains
Glenn Colescott, director of ICAPE USA, speaks with I-Connect007's Patty Goldman about his company, their expansion plans, why they attend regional shows like the SMTA West Penn Chapter Expo & Tech Forum, and how they make customers get over the phobia over a trading company.
IMPACT Washington, D.C. 2016: Industry Leaders Advocate for a Pro-Manufacturing Policy Agenda
IPC places a high priority on educating government officials about key policy issues of importance to the electronics industry. That’s why top executives from leading electronics companies gathered in Washington, D.C. recently for “IMPACT Washington, D.C. 2016.”
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