It’s Only Common Sense: Great Ideas From John Mitchell’s Book on Hiring Habits
Punching Out: Breaking Out of the Valuation Box
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBsAIM to Host SMT High-Reliability Technology Seminar in China
December 4, 2017 | AIM SolderEstimated reading time: 2 minutes
AIM Solder will co-host the SMT Electronics Assembly High-Reliability Technology Seminar in Shenzhen, China on December 8, 2017. AIM will present two of its most recent papers at the seminar.
Derek Wang, Technical Support Manager, will present the white paper titled “An In-Depth Look at a New Low Cost and High-Reliability Alloy Alternative to SAC305 and Low-/No-Silver Alloys.” His presentation will cover the evolution of lead-free soldering and the limitations of SAC305, the current standard for lead-free electronics soldering. It will explore the effects of nickel, bismuth and other micro-alloy dopants on mechanical and soldering performance.
Flopy Feng, Technical Support Engineer, will present AIM’s paper “The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance,” which highlights the benefits and implications of finer mesh solder powder on critical aspects of solder paste performance. In this study, the key input variables included powder size, effect of room temperature storage, pause time and PCB feature types. Output included print transfer efficiency, volume repeatability and performance stability over time.
This free seminar, hosted by AIM, Axxon, Mycronic, and Zestron, will be held at the Silicon Valley Power Vehicle Electronic Business Park in Shenzhen, China. For more information, please contact Michelle Peng via email at mpeng@aimsolder.com or by phone at 130-6694-5432.
About the Presenters
Derek Wang is a Technical Support Manager for AIM Solder. He is a SMTA Certified Engineer and also serves as a SMT Processes Trainer. With over thirteen years’ experience in the SMT industry, Derek supports AIM customers in Eastern China.
Flopy Feng is a Technical Support Engineer for AIM Solder. Having worked as a process supervisor for seven years, he is experienced in process evaluation and optimization. With over fourteen years’ experience in the SMT industry, Flopy supports AIM customers in south China.
About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, visit www.aimsolder.com.
Share on:
Suggested Items
Indium Experts to Present at Electronics in Harsh Environments SMTA Conference
05/13/2024 | Indium Corporationndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.