OUR COLUMNISTS


Marc Carter

Marc Carter, Aeromarc LLC

This is a series of columns or articles based on a course at Michigan Tech on PCB design, manufacturing, and assembly.

Latest Column: Better to Light a Candle: Chapter 11—Expanding and Adapting in the Face of the Pandemic


Barry Olney

Barry Olney, In-Circuit Design Pty. Ltd.

Barry focuses on advanced PCB design, signal integrity, and EMC design techniques.

Latest Column: Beyond Design: Stackup Configurations to Mitigate Crosstalk


Dana Korf

Dana Korf, Korf Consultancy LLC

Dana's columns focus on IPC-2581 as well as PCB front-end tooling, data quality, DFM processes, etc.

Latest Column: Dana on Data: Factory 4.0 NPI Data Transfer Improvements


Dennis Fritz

Dennis Fritz, Fritz Consulting

Dennis covers military and defense industry topics and applications.

Latest Column: Defense Speak Interpreted: So, What’s a JADC2?


Vern Solberg

Vern Solberg, Consulting

This column will focus on technical issues related to PCB and Flex circuit design, etc.

 

Latest Column: Designers Notebook: Developing Panel Level Semiconductor Packaging


Dominique Numakura

Dominique Numakura, DKN Research

Dominique Numakura offers weekly updates on the PCB industry in Japan, from M&A activity to technological breakthroughs.

Latest Column: EPTE Newsletter: Taiwan Releases 2020 PCB Production Numbers


Tara Dunn

Tara Dunn, Averatek

When it comes to Flexible Interconnect circuits, Tara really knows what she is talking about!

Latest Column: Flex Talk: Demystify Flexible Stack-ups


Joe Fjelstad

Joe Fjelstad, Verdant Electronics

As author of the Flexible Circuit Technology books, Joe covers everything to do with flexible interconnections in this column.

Latest Column: Flexible Thinking: IC Package Footprints—Why So Many and How Many Is Enough?


IPC Education Foundation

IPC Education Foundation, IPC

Members from the IPC Education Foundation share updates on programs and activities.

Latest Column: Foundations of the Future: IPC Education Foundation Update and Looking Ahead


Mike Hill

Mike Hill, MIL-Q-Consulting LLC

Mike’s columns will help you better understand the requirements and how-to’s for MIL-PRF-31032 certification for PWB fabrication.

Latest Column: From The Hill: Pillars of Mil-Aero Technology and Revenue


Dan Beaulieu

Dan Beaulieu, DB Management

This weekly column is focused on helping electronics companies enhance their professional and technical image through sales and marketing, and, of course, common sense.

Latest Column: It’s Only Common Sense: The PCB is Not a Commodity


Marc Ladle

Marc Ladle, Viking Test Ltd.

Marc’s columns deal with various aspects of PCB production, focusing especially on troubleshooting production problems.

Latest Column: Ladle on Manufacturing: LED UV Cure—Does It Really Work?


Yair Alcobi

Yair Alcobi, Orbotech

Orbotech shares its expert knowledge on how to maximize the value of manufacturing systems.

Latest Column: Language of Electronics: Key Considerations for Your Next Direct Imaging System


John Coonrod

John Coonrod, Rogers Corporation

John Coonrod offers PCB designers advice on modern laminates, with a focus on high-speed substrates.

Latest Column: Lightning Speed Laminates: Things to Consider When Creating a Circuit Material Library


Doug Sober

Doug Sober, Essex Technologies Group

Doug writes about the problems of & concerns with PCB laminate materials and their specifications.

 

Latest Column: Mr. Laminate Tells All: Is Your Laminate and Prepreg Supplier Cheating? Only One Way to Find Out


John Mitchell

John Mitchell, IPC

John will cover issues affecting the entire global electronics industry supply chain.

Latest Column: One World, One Industry: Join Us for IPC APEX EXPO—Virtually


Tom Kastner

Tom Kastner, GP Ventures, Ltd.

'Punching Out' is a series of articles on mergers and acquisitions in the PCB and assembly sectors.

Latest Column: Punching Out! The ROI of M&A


Eric Camden

Eric Camden, Foresite

Eric addresses PCBA reliability issues and how to prevent suspect conditions in the first place.

Latest Column: Quest for Reliability: Here We Go (Virtual) Again


Team ASC

Team ASC, American Standard Circuits

The experts behind this column strive to make all facets of printed circuit board technology clear and easy to understand.

Latest Column: Standard of Excellence: Being a Great Customer


Todd Kolmodin

Todd Kolmodin, Gardien Services, USA

Todd covers a range of electrical test and reliability issues.

Latest Column: Testing Todd: Owning Your Processes


Mark Thompson

Mark Thompson, Monsoon Solutions Inc.

Mark Thompson discusses PCB design from a fabricator's viewpoint, with a focus on DFM issues.

Latest Column: The Bare (Board) Truth: Stackups—Properly Conveying Your Info to the Fabricator


Mehul Davé

Mehul Davé, Entelechy Global and Linkage Technologies

Mehul's column explores benefits for outsourcing CAM engineering.

Latest Column: The Big Picture: Globalization—Imagine a United States That Isn't United


Chris Mitchell

Chris Mitchell, IPC

In this column, IPC VP of Global Government Affairs Chris Mitchell and his team provide news and views on government policies that affect the electronics industry and its supply chain.

Latest Column: The Government Circuit: IPC is Ready for the Year of Advocacy Ahead


Team Elmatica

Team Elmatica, Elmatica

The PCB Norsemen from Elmatica share their knowledge, experience, technical advice, and thoughts about the fascinating world of PCBs.

Latest Column: The PCB Norsemen: Attacking the Loophole That Does Not Exist


George Milad

George Milad, Uyemura International Corporation

George's columns cover PCB plating, IPC specifications, and more

Latest Column: The Plating Forum: Training for Plating Processes in the Electronics Industry


Martyn Gaudion

Martyn Gaudion, Polar Instruments

In his column, Martyn discusses signal integrity and impedance design test.

Latest Column: The Pulse: Don’t Ignore DC Trace Resistance


Steve Williams

Steve Williams, The Right Approach Consulting

A no-nonsense view of manufacturing and management strategies from one of electronic manufacturing's top authorities.

Latest Column: The Right Approach: Leadership 101—The Law of the Lid


Michael Carano

Michael Carano, RBP Chemical Technology

A comprehensive look at plating, metallization processes and PWB fabrication techniques.

Latest Column: Trouble In Your Tank: Process Management and Control—Benchmarking Best Practices


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